PIC16F876A-I/SO Microchip Technology, PIC16F876A-I/SO Datasheet - Page 641
![IC MCU FLASH 8KX14 EE 28SOIC](/photos/6/59/65909/150-28-soic_sml.jpg)
PIC16F876A-I/SO
Manufacturer Part Number
PIC16F876A-I/SO
Description
IC MCU FLASH 8KX14 EE 28SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16C770-ISO.pdf
(8 pages)
4.PIC16F873A-ISO.pdf
(234 pages)
5.PIC16F873A-ISO.pdf
(6 pages)
6.PIC16F873A-ISO.pdf
(4 pages)
7.PIC16F873A-ISO.pdf
(6 pages)
8.PIC16F873A-ISO.pdf
(4 pages)
9.PIC16F873A-ISO.pdf
(22 pages)
Specifications of PIC16F876A-I/SO
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-SOIC (7.5mm Width)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
CCP, I2C, MSSP, SPI, USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
22
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022, DV164120
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 5 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
PIC16F876AI/SO
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F876A-I/SO
Manufacturer:
IDT
Quantity:
201
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16C770-ISO PDF datasheet #3
- PIC16F873A-ISO PDF datasheet #4
- PIC16F873A-ISO PDF datasheet #5
- PIC16F873A-ISO PDF datasheet #6
- PIC16F873A-ISO PDF datasheet #7
- PIC16F873A-ISO PDF datasheet #8
- PIC16F873A-ISO PDF datasheet #9
- Current page: 641 of 688
- Download datasheet (3Mb)
32.3.3
32.3.4
1997 Microchip Technology Inc.
MPLINK Linker
MPLIB Librarian
MPLINK is a linker for the Microchip C compiler, MPLAB-C, and the Microchip relocatable assem-
bler, MPASM. MPLINK is introduced with MPLAB-C v2.00 and can only be used with these or
later versions.
MPLINK allows you to produce modular, re-usable code with MPLAB-C and MPASM. Control
over the linking process is accomplished through a linker “script” file and with command line
options. MPLINK ensures that all symbolic references are resolved and that code and data fit into
the available PICmicro device.
MPLINK combines multiple input object modules generated by MPLAB-C or MPASM, into a sin-
gle executable file. The actual addresses of data and the location of functions will be assigned
when MPLINK is executed. This means that you will instruct MPLINK to place code and data
somewhere within the named regions of memory, not to specific physical locations.
Once the linker knows about the ROM and RAM memory regions available in the target PICmicro
device and it analyzes all the input files, it will try to fit the application’s routines into ROM and
assign it’s data variables into available RAM. If there is too much code or too many variables to
fit, MPLINK will give an error message.
MPLINK also provides flexibility for specifying that certain blocks of data memory are re-usable,
so that different routines (which never call each other and don’t depend on this data to be
retained between execution) can share limited RAM space.
MPLIB is a librarian for use with COFF object modules created using either MPASM v2.0,
MPASMWIN v2.0, or MPLAB-C v2.0 or later.
MPLIB manages the creation and modification of library files. A library file is a collection of object
modules that are stored in a single file. There are several reasons for creating library files:
• Libraries make linking easier. Since library files can contain many object files, the name of
• Libraries help keep code small. Since a linker only uses the required object files contained
• Libraries make projects more maintainable. If a library is included in a project, the addition
• Libraries help convey the purpose of a group of object modules. Since libraries can group
a library file can be used instead of the names of many separate object when linking.
in a library, not all object files which are contained in the library necessarily wind up in the
linker’s output module.
or removal of calls to that library will not require a change to the link process.
together several related object modules, the purpose of a library file is usually more under-
standable that the purpose of its individual object modules. For example, the purpose of a
file named “math.lib” is more apparent that the purpose of 'power.o', 'ceiling.o', and 'floor.o'.
Section 32. Development Tools
DS31032A-page 32-7
32
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