PIC18F8390-I/PT Microchip Technology, PIC18F8390-I/PT Datasheet - Page 292
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC18F8390-I/PT
Manufacturer Part Number
PIC18F8390-I/PT
Description
IC PIC MCU FLASH 4KX16 80TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC18F6310-IPT.pdf
(28 pages)
3.PIC18F6390-IPT.pdf
(414 pages)
4.PIC18F6390-IPT.pdf
(16 pages)
5.PIC18F6390-IPT.pdf
(12 pages)
6.PIC18F6390-IPT.pdf
(6 pages)
7.PIC18F6390-IPT.pdf
(4 pages)
8.PIC18F8490-IPT.pdf
(412 pages)
Specifications of PIC18F8390-I/PT
Program Memory Type
FLASH
Program Memory Size
8KB (4K x 16)
Package / Case
80-TFQFP
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, LCD, POR, PWM, WDT
Number Of I /o
66
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
SPI, I2C, EUSART, AUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
66
Number Of Timers
4
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM163028
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPDM163028 - BOARD DEMO PICDEM LCDAC164320 - MODULE SKT MPLAB PM3 80TQFPAC174011 - MODULE SKT PROMATEII 80TQFP
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18F8390-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC18F8390-I/PT
Manufacturer:
MICRO
Quantity:
20 000
- PIC16F616T-ISL PDF datasheet
- PIC18F6310-IPT PDF datasheet #2
- PIC18F6390-IPT PDF datasheet #3
- PIC18F6390-IPT PDF datasheet #4
- PIC18F6390-IPT PDF datasheet #5
- PIC18F6390-IPT PDF datasheet #6
- PIC18F6390-IPT PDF datasheet #7
- PIC18F8490-IPT PDF datasheet #8
- Current page: 292 of 412
- Download datasheet (8Mb)
PIC18F6390/6490/8390/8490
23.4
The Fail-Safe Clock Monitor (FSCM) allows the
microcontroller to continue operation in the event of an
external oscillator failure by automatically switching the
device clock to the internal oscillator block. The FSCM
function is enabled by setting the FCMEN configuration
bit.
When FSCM is enabled, the INTRC oscillator runs at
all times to monitor clocks to peripherals and provide a
backup clock in the event of a clock failure. Clock
monitoring (shown in Figure 23-3) is accomplished by
creating a sample clock signal, which is the INTRC out-
put divided by 64. This allows ample time between
FSCM sample clocks for a peripheral clock edge to
occur. The peripheral device clock and the sample
clock are presented as inputs to the Clock Monitor latch
(CM). The CM is set on the falling edge of the device
clock source, but cleared on the rising edge of the
sample clock.
FIGURE 23-3:
Clock failure is tested for on the falling edge of the
sample clock. If a sample clock falling edge occurs
while CM is still set, a clock failure has been detected
(Figure 23-4). This causes the following:
• the FSCM generates an oscillator fail interrupt by
• the device clock source is switched to the internal
• the WDT is reset.
During switchover, the postscaler frequency from the
internal oscillator block may not be sufficiently stable for
timing sensitive applications. In these cases, it may be
desirable to select another clock configuration and enter
an alternate power managed mode. This can be done to
attempt a partial recovery or execute a controlled shut-
down. See Section 3.1.2 “Entering Power Managed
Modes” and Section 23.3.1 “Special Considerations
for Using Two-Speed Start-up” for more details.
DS39629B-page 290
setting bit OSCFIF (PIR2<7>);
oscillator block (OSCCON is not updated to show
the current clock source – this is the Fail-Safe
condition); and
Peripheral
Source
INTRC
(32 µs)
Clock
Fail-Safe Clock Monitor
(2.048 ms)
488 Hz
÷ 64
FSCM BLOCK DIAGRAM
(edge-triggered)
Clock Monitor
Latch (CM)
C
S
Q
Q
Detected
Failure
Clock
Preliminary
To use a higher clock speed on wake-up, the INTOSC
or postscaler clock sources can be selected to provide
a higher clock speed by setting bits, IFRC2:IFRC0,
immediately after Reset. For wake-ups from Sleep, the
INTOSC or postscaler clock sources can be selected
by setting the IFRC2:IFRC0 bits prior to entering Sleep
mode.
The FSCM will detect failures of the primary or second-
ary clock sources only. If the internal oscillator block
fails, no failure would be detected, nor would any action
be possible.
23.4.1
Both the FSCM and the WDT are clocked by the
INTRC oscillator. Since the WDT operates with a
separate divider and counter, disabling the WDT has
no effect on the operation of the INTRC oscillator when
the FSCM is enabled.
As already noted, the clock source is switched to the
INTOSC clock when a clock failure is detected.
Depending on the frequency selected by the
IRCF2:IRCF0 bits, this may mean a substantial change
in the speed of code execution. If the WDT is enabled
with a small prescale value, a decrease in clock speed
allows a WDT time-out to occur and a subsequent
device Reset. For this reason, Fail-Safe Clock events
also reset the WDT and postscaler, allowing it to start
timing from when execution speed was changed and
decreasing the likelihood of an erroneous time-out.
23.4.2
The Fail-Safe condition is terminated by either a device
Reset or by entering a power managed mode. On
Reset, the controller starts the primary clock source
specified in Configuration Register 1H (with any
required start-up delays that are required for the oscil-
lator mode, such as the OST or PLL timer). The
INTOSC multiplexer provides the device clock until the
primary clock source becomes ready (similar to a Two-
Speed Start-up). The clock source is then switched to
the primary clock (indicated by the OSTS bit in the
OSCCON register becoming set). The Fail-Safe Clock
Monitor then resumes monitoring the peripheral clock.
The primary clock source may never become ready
during start-up. In this case, operation is clocked by the
INTOSC multiplexer. The OSCCON register will remain
in its Reset state until a power managed mode is
entered.
FSCM AND THE WATCHDOG TIMER
EXITING FAIL-SAFE OPERATION
2004 Microchip Technology Inc.
Related parts for PIC18F8390-I/PT
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
![PIC18F-LF1XK50](/images/no-image3.png)
Part Number:
Description:
20-Pin USB Flash Microcontrollers
Manufacturer:
MICROCHIP [Microchip Technology]
Datasheet:
![PIC18F6393T-I/PT](/photos/6/81/68123/c04-066_pf_tmb.jpg)
Part Number:
Description:
PIC18F With 128-segment LCD Driver And 12-bit ADC, 8KB Flash, 768B RAM, CCP, MSS
Manufacturer:
Microchip Technology
Datasheet:
![PIC18F6493T-I/PT](/photos/6/81/68123/c04-066_pf_tmb.jpg)
Part Number:
Description:
PIC18F With 128-segment LCD Driver And 12-bit ADC, 16KB Flash, 768B RAM, CCP, MS
Manufacturer:
Microchip Technology
Datasheet:
![PIC18F8393T-I/PT](/images/manufacturer_photos/0/4/439/microchip_technology_tmb.jpg)
Part Number:
Description:
PIC18F With 192-segment LCD Driver And 12-bit ADC, 8KB Flash, 768B RAM, CCP, MSS
Manufacturer:
Microchip Technology
Datasheet:
![PIC18F8493T-I/PT](/images/manufacturer_photos/0/4/439/microchip_technology_tmb.jpg)
Part Number:
Description:
PIC18F With 192-segment LCD Driver And 12-bit ADC, 16KB Flash, 768B RAM, CCP, MS
Manufacturer:
Microchip Technology
Datasheet:
![PIC18F6585-I/L](/photos/16/12/161282/68-plcc-large-300dpi-lyrd_tmb.jpg)
Part Number:
Description:
Microcontrollers (MCU) 48KB 3328 RAM 52 I/O
Manufacturer:
Microchip Technology
Datasheet:
![PIC18F6680-I/L](/photos/16/12/161282/68-plcc-large-300dpi-lyrd_tmb.jpg)
Part Number:
Description:
Microcontrollers (MCU) 64KB 3328 RAM 52 I/O
Manufacturer:
Microchip Technology
Datasheet:
![PIC18F65K90T-I/MR](/photos/16/3/160368/qfn64_tmb.jpg)
Part Number:
Description:
32kB Flash, 2kB RAM, 1kB EE, NanoWatt XLP, LCD 64 QFN 9x9x0.9mm T/R
Manufacturer:
Microchip Technology
Datasheet:
![PIC18F65K90T-I/PT](/photos/16/3/160367/tqfp-64_tmb.jpg)
Part Number:
Description:
32kB Flash, 2kB RAM, 1kB EE, NanoWatt XLP, LCD 64 TQFP 10x10x1mm T/R
Manufacturer:
Microchip Technology
Datasheet:
![PIC18F87K90T-I/PT](/photos/40/31/403173/tqfp-80_tmb.jpg)
Part Number:
Description:
128kB Flash, 4kB RAM, 1kB EE, 16MIPS, NanoWatt XLP, LCD, 5V 80 TQFP 12x12x1mm T/
Manufacturer:
Microchip Technology
Datasheet:
![PIC18F65K90-I/MR](/photos/16/3/160368/qfn64_tmb.jpg)
Part Number:
Description:
32kB Flash, 2kB RAM, 1kB EE, NanoWatt XLP, LCD 64 QFN 9x9x0.9mm TUBE
Manufacturer:
Microchip Technology
Datasheet:
![PIC18F65K90-I/PT](/photos/16/3/160367/tqfp-64_tmb.jpg)
Part Number:
Description:
32kB Flash, 2kB RAM, 1kB EE, NanoWatt XLP, LCD 64 TQFP 10x10x1mm TRAY
Manufacturer:
Microchip Technology
![PIC18F87K90-I/PT](/photos/40/31/403173/tqfp-80_tmb.jpg)
Part Number:
Description:
128kB Flash, 4kB RAM, 1kB EE, 16MIPS, NanoWatt XLP, LCD, 5V 80 TQFP 12x12x1mm TR
Manufacturer:
Microchip Technology