PIC24FJ64GB002-I/ML Microchip Technology, PIC24FJ64GB002-I/ML Datasheet - Page 60

• Manufacturer Part Number: PIC24FJ64GB002-I/ML
• Description: IC MCU 16BIT 64KB FLASH 28QFN
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 24Fr

Specifications of PIC24FJ64GB002-I/ML

• Program Memory Type: FLASH
• Program Memory Size: 64KB (22K x 24)
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I²C, IrDA, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 19
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC24FJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C/IrDA/SPI/UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 19
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240011
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 9-ch x 10-bit
• Controller Family/series: PIC24
• Ram Memory Size: 8KB
• Cpu Speed: 32MHz
• No. Of Timers: 5
• Embedded Interface Type: I2C, LIN, SPI, UART, USB
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC24FJ64GB004 FAMILY
EXAMPLE 5-4:
EXAMPLE 5-5:
EXAMPLE 5-6:
DS39940D-page 60
// C example using MPLAB C30
//Set up NVMCON for row programming
//Set up pointer to the first memory location to be written
//Perform TBLWT instructions to write necessary number of latches
for(i=0; i < 2*NUM_INSTRUCTION_PER_ROW; i++)
// C example using MPLAB C30
asm("DISI #5");
__builtin_write_NVM();
#define NUM_INSTRUCTION_PER_ROW 64
unsigned int offset;
unsigned int i;
unsigned long progAddr = 0xXXXXXX;
unsigned int progData[2*NUM_INSTRUCTION_PER_ROW];
NVMCON = 0x4001;
TBLPAG = progAddr>>16;
offset = progAddr & 0xFFFF;
{
}
__builtin_tblwtl(offset, progData[i++]);
__builtin_tblwth(offset, progData[i]);
offset = offset + 2;
DISI
MOV
MOV
MOV
MOV
BSET
NOP
NOP
BTSC
BRA
#5
#0x55, W0
W0, NVMKEY
#0xAA, W1
W1, NVMKEY
NVMCON, #WR
NVMCON, #15
$-2
LOADING THE WRITE BUFFERS – ‘C’ LANGUAGE CODE
INITIATING A PROGRAMMING SEQUENCE – ASSEMBLY LANGUAGE CODE
INITIATING A PROGRAMMING SEQUENCE – ‘C’ LANGUAGE CODE
// Block all interrupts with priority < 7
// for next 5 instructions
// Perform unlock sequence and set WR
; Block all interrupts with priority <7
; for next 5 instructions
; Write the 55 key
;
; Write the AA key
; Start the erase sequence
;
;
; and wait for it to be
; completed
// Buffer of data to write
// Write to address low word
// Write to upper byte
// Address of row to write
// Initialize NVMCON
// Initialize PM Page Boundary SFR
// Initialize lower word of address
// Increment address
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