DSPIC30F2011-30I/ML Microchip Technology, DSPIC30F2011-30I/ML Datasheet - Page 58
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DSPIC30F2011-30I/ML
Manufacturer Part Number
DSPIC30F2011-30I/ML
Description
IC DSPIC MCU/DSP 12K 28QFN
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F2011-20ISO.pdf
(210 pages)
3.DSPIC30F2011-20ISO.pdf
(14 pages)
4.DSPIC30F2011-20ISO.pdf
(6 pages)
5.DSPIC30F2011-20ISO.pdf
(18 pages)
6.DSPIC30F2011-20IP.pdf
(206 pages)
Specifications of DSPIC30F2011-30I/ML
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
12
Program Memory Size
12KB (4K x 24)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
Core Frequency
40MHz
Core Supply Voltage
5.5V
Embedded Interface Type
I2C, SPI, UART
No. Of I/o's
12
Flash Memory Size
12KB
Supply Voltage Range
2.5V To 5.5V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DAF30-4 - DEVICE ATP FOR ICE4000
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
DSPIC30F201130IML
13.0
TABLE 13-1:
DS70102K-page 58
AC/DC CHARACTERISTICS
D110
D112
D113
D001
D002
D031
D041
D080
D090
D012
P1
P1a
P1b
P2
P3
P4
P4a
P5
P6
P7
P8
P9a
Param.
No.
AC/DC CHARACTERISTICS AND TIMING REQUIREMENTS
V
I
I
V
V
V
V
V
V
C
T
T
T
T
T
T
T
T
T
T
T
T
PP
DDP
SCLK
SCLK
SCLK
SET
SET
IL
IH
OL
OH
HLD
DLY
DLY
DLY
HLD
DLY
DLY
IHH
DD
DDBULK
IO
Sym
1
2
1
1a
2
3
4
1
2
L
H
AC/DC CHARACTERISTICS
High Programming Voltage on MCLR/V
Programming Current on MCLR/V
Supply Current during programming
Supply voltage
Supply voltage for Bulk Erase
programming
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
Capacitive Loading on I/O Pin (PGD)
Serial Clock (PGC) period
Serial Clock (PGC) low time
Serial Clock (PGC) high time
Input Data Setup Timer to PGC ↓
Input Data Hold Time from PGC ↓
Delay between 4-bit command and
command operand
Delay between 4-bit command operand
and next 4-bit command
Delay between last PGC ↓ of command to
first PGC ↑ of VISI output
V
Input data hold time from MCLR/V
Delay between last PGC ↓ of command
word to PGD driven ↑ by programming
executive
Programming Executive Command
processing time
DD
↑ setup time to MCLR/V
Characteristic
PP
PP
PP
↑
PP
Standard Operating Conditions
(unless otherwise stated)
Operating Temperature: 25° C is recommended
V
0.8 V
DD
9.00
Min
V
400
400
100
2.5
4.5
50
20
20
15
15
20
20
20
20
10
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1
2
5
SS
- 0.7
DD
0.2 V
13.25
Max
V
300
5.5
5.5
0.6
30
30
30
50
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DD
SS
© 2010 Microchip Technology Inc.
Units
mA
mA
mA
ms
μA
pF
ns
ns
ns
μs
ns
ns
ns
ns
ns
ns
ns
ns
μs
μs
μs
V
V
V
V
V
V
V
Row Erase
Program
memory
Row Erase
Data EEPROM
Bulk Erase
I
I
To meet AC
specifications
ICSP™ mode
Enhanced
ICSP mode
ICSP mode
Enhanced
ICSP mode
ICSP mode
Enhanced
ICSP mode
ICSP mode
Enhanced
ICSP mode
OL
OH
Conditions
= 8.5 mA
= -3.0 mA
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