PIC18F97J60T-I/PT Microchip Technology, PIC18F97J60T-I/PT Datasheet - Page 301

IC PIC MCU FLASH 64KX16 100TQFP

PIC18F97J60T-I/PT

Manufacturer Part Number
PIC18F97J60T-I/PT
Description
IC PIC MCU FLASH 64KX16 100TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F97J60T-I/PT

Core Size
8-Bit
Program Memory Size
128KB (64K x 16)
Oscillator Type
Internal
Core Processor
PIC
Speed
41.667MHz
Connectivity
EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
70
Program Memory Type
FLASH
Ram Size
3808 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x10b
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TFQFP
Controller Family/series
PIC18
No. Of I/o's
70
Ram Memory Size
3808Byte
Cpu Speed
41.667MHz
No. Of Timers
5
No. Of
RoHS Compliant
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3808 B
Interface Type
Display Driver, Ethernet, EUSART, I2C, MSSP, SPI
Maximum Clock Frequency
41.667 MHz
Number Of Programmable I/os
70
Number Of Timers
5
Operating Supply Voltage
2.35 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DV164136, DM183033
Minimum Operating Temperature
- 40 C
On-chip Adc
16 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC162064 - HEADER INTFC MPLABICD2 64/80/100DM163024 - BOARD DEMO PICDEM.NET 2AC164323 - MODULE SKT FOR 100TQFP
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F97J60T-I/PT
Manufacturer:
MICROCHIP
Quantity:
12 000
Part Number:
PIC18F97J60T-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
19.4.17.2
During a Repeated Start condition, a bus collision
occurs if:
a)
b)
When the user deasserts SDAx and the pin is allowed
to float high, the BRG is loaded with SSPxADD<6:0>
and counts down to 0. The SCLx pin is then deasserted
and when sampled high, the SDAx pin is sampled.
If SDAx is low, a bus collision has occurred (i.e., another
master is attempting to transmit a data ‘0’, see
Figure 19-31). If SDAx is sampled high, the BRG is
FIGURE 19-31:
FIGURE 19-32:
© 2009 Microchip Technology Inc.
A low level is sampled on SDAx when SCLx
goes from low level to high level.
SCLx goes low before SDAx is asserted low,
indicating that another master is attempting to
transmit a data ‘1’.
SSPxIF
BCLxIF
BCLxIF
SSPxIF
RSEN
RSEN
SDAx
SCLx
SDAx
SCLx
Bus Collision During a Repeated
Start Condition
S
S
BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
set BCLxIF. Release SDAx and SCLx.
SCLx goes low before SDAx,
T
BRG
Sample SDAx when SCLx goes high.
If SDAx = 0, set BCLxIF and release SDAx and SCLx.
PIC18F97J60 FAMILY
reloaded and begins counting. If SDAx goes from
high-to-low before the BRG times out, no bus collision
occurs because no two masters can assert SDAx at
exactly the same time.
If SCLx goes from high-to-low before the BRG times
out and SDAx has not already been asserted, a bus
collision occurs. In this case, another master is
attempting to transmit a data ‘1’ during the Repeated
Start condition (see Figure 19-32).
If, at the end of the BRG time-out, both SCLx and SDAx
are still high, the SDAx pin is driven low and the BRG
is reloaded and begins counting. At the end of the
count, regardless of the status of the SCLx pin, the
SCLx pin is driven low and the Repeated Start
condition is complete.
Cleared in software
T
BRG
Interrupt cleared
in software
‘0’
‘0’
DS39762E-page 301
‘0’

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