PIC24HJ16GP304-I/PT Microchip Technology, PIC24HJ16GP304-I/PT Datasheet - Page 15

• Manufacturer Part Number: PIC24HJ16GP304-I/PT
• Description: IC PIC MCU FLASH 16K 44TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ16GP304-I/PT

• Core Size: 16-Bit
• Program Memory Size: 16KB (5.5K x 24)
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Core Processor: PIC
• Speed: 40 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Number Of I /o: 35
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 13x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-TQFP, 44-VQFP
• Controller Family/series: PIC24
• No. Of I/o's: 35
• Ram Memory Size: 2KB
• Cpu Speed: 40MIPS
• No. Of Timers: 4
• Processor Series: PIC24HJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 2 KB
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 35
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 13 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARDDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

2.0
2.1
Getting started with the PIC24HJ32GP202/204 and
PIC24HJ16GP304 family of 16-bit microcontrollers
requires attention to a minimal set of device pin
connections before proceeding with development. The
following is a list of pin names, which must always be
connected:
• All V
• All AV
• V
• MCLR pin
• PGECx/PGEDx pins used for In-Circuit Serial
• OSC1 and OSC2 pins when external oscillator
Additionally, the following pins may be required:
• V
 2009 Microchip Technology Inc.
(see Section 2.2 “Decoupling Capacitors”)
used)
(see Section 2.2 “Decoupling Capacitors”)
(see Section 2.3 “Capacitor on Internal Voltage
Regulator (Vcap/Vddcore)”)
(see Section 2.4 “Master Clear (MCLR) Pin”)
Programming™ (ICSP™) and debugging purposes
(see Section 2.5 “ICSP Pins”)
source is used
(see Section 2.6 “External Oscillator Pins”)
reference for ADC module is implemented
Note:
Note 1: This data sheet summarizes the features
REF
CAP
DD
+/V
/V
DD
2: Some registers and associated bits
GUIDELINES FOR GETTING
STARTED WITH 16-BIT
MICROCONTROLLERS
Basic Connection Requirements
DDCORE
and V
REF
and AV
The AV
connected independent of the ADC
voltage reference source.
of
PIC24HJ16GP304 family of devices. It is
not intended to be a comprehensive refer-
ence source. To complement the informa-
tion in this data sheet, refer to the
“dsPIC33F/PIC24H Family Reference
Manual”, which is available from the
Microchip website (www.microchip.com).
described in this section may not be avail-
able on all devices. Refer to Section 4.0
“Memory Organization” in this data
sheet for device-specific register and bit
information.
PIC24HJ32GP202/204 and PIC24HJ16GP304
- pins used when external voltage
SS
the
SS
pins
DD
pins (even if ADC module is not
PIC24HJ32GP202/204
and AV
SS
pins must be
and
Preliminary
2.2
The use of decoupling capacitors on every pair of
power supply pins, such as V
AV
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
• Placement on the printed circuit board: The
• Handling high frequency noise: If the board is
• Maximizing performance: On the board layout
of 0.1 µF (100 nF), 10-20V. This capacitor should
be a low-ESR and have a resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the microcontroller. If space is con-
stricted, the capacitor can be placed on another
layer on the PCB using a via; however, ensure
that the trace length from the pin to the capacitor
is within one-quarter inch (6 mm) in length.
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the microcontroller pins. This ensures
that the decoupling capacitors are first in the
power chain. Equally important is to keep the
trace length between the capacitor and the power
pins to a minimum thereby reducing PCB track
inductance.
SS
is required.
Decoupling Capacitors
DD
, V
DS70289F-page 15
SS
, AV
DD
and