DSPIC30F2012-20I/ML Microchip Technology, DSPIC30F2012-20I/ML Datasheet - Page 167

• Manufacturer Part Number: DSPIC30F2012-20I/ML
• Description: IC DSPIC MCU/DSP 12K 28QFN
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F2012-20I/ML

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 20
• Program Memory Size: 12KB (4K x 24)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 10x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Core Frequency: 40MHz
• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 20
• Flash Memory Size: 12KB
• Supply Voltage Range: 2.5V To 5.5V
• Operating Temperature Range: -40°C To +85°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: DSPIC30F201220IML

TABLE 20-22: BAND GAP START-UP TIME REQUIREMENTS
FIGURE 20-8:
© 2005 Microchip Technology Inc.
AC CHARACTERISTICS
SY40
Note 1:
Param
No.
2:
T
Note: Refer to Figure 20-3 for load conditions.
TxCK
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 5V, 25°C unless otherwise stated.
Symbol
BGAP
TMRX
Band Gap Start-up Time
TYPE A, B AND C TIMER EXTERNAL CLOCK TIMING CHARACTERISTICS
Characteristic
dsPIC30F2011/2012/3012/3013
(1)
Tx10
Standard Operating Conditions: 2.5V to 5.5V
(unless otherwise stated)
Operating temperature
Min
—
Preliminary
Typ
20
Tx15
OS60
(2)
Max
50
Tx11
Units
-40°C T
-40°C
µs
Defined as the time between the
instant that the band gap is enabled
and the moment that the band gap
reference voltage is stable.
RCON<13>Status bit
T
A
A
+85°C for Industrial
+125°C for Extended
Tx20
Conditions
DS70139C-page 165