PIC16F886-I/SP Microchip Technology, PIC16F886-I/SP Datasheet - Page 103
![IC PIC MCU FLASH 8KX14 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC16F886-I/SP
Manufacturer Part Number
PIC16F886-I/SP
Description
IC PIC MCU FLASH 8KX14 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.MCP1631RD-MCC2.pdf
(328 pages)
3.PIC16F882-ISS.pdf
(16 pages)
4.PIC16F882-ISS.pdf
(36 pages)
5.PIC16F883-ISO.pdf
(288 pages)
Specifications of PIC16F886-I/SP
Program Memory Type
FLASH
Program Memory Size
14KB (8K x 14)
Package / Case
28-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
256 x 8
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
368 B
Interface Type
MSSP/EUSART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
24
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM164123, DM164120-3, DV164122
Minimum Operating Temperature
- 40 C
On-chip Adc
11-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM164123 - KIT MANAGEMENT SYSTEM PICDEMDVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LD
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F886-I/SP
Manufacturer:
NXP
Quantity:
2 400
- PIC16F616T-ISL PDF datasheet
- MCP1631RD-MCC2 PDF datasheet #2
- PIC16F882-ISS PDF datasheet #3
- PIC16F882-ISS PDF datasheet #4
- PIC16F883-ISO PDF datasheet #5
- Current page: 103 of 288
- Download datasheet (5Mb)
TABLE 9-1:
FIGURE 9-2:
9.1.5
The ADC module allows for the ability to generate an
interrupt upon completion of an Analog-to-Digital
conversion. The ADC interrupt flag is the ADIF bit in the
PIR1 register. The ADC interrupt enable is the ADIE bit
in the PIE1 register. The ADIF bit must be cleared in
software.
This interrupt can be generated while the device is
operating or while in Sleep. If the device is in Sleep, the
interrupt will wake-up the device. Upon waking from
Sleep, the next instruction following the SLEEP
instruction is always executed. If the user is attempting
to wake-up from Sleep and resume in-line code
execution, the global interrupt must be disabled. If the
global interrupt is enabled, execution will switch to the
Interrupt Service Routine.
Please see Section 14.3 “Interrupts” for more
information.
© 2007 Microchip Technology Inc.
Legend: Shaded cells are outside of recommended range.
Note 1:
ADC Clock Source
Note:
F
2:
3:
4:
F
F
OSC
OSC
OSC
F
ADC Clock Period (T
RC
The F
These values violate the minimum required T
For faster conversion times, the selection of another clock source is recommended.
When the device frequency is greater than 1 MHz, the F
conversion will be performed during Sleep.
INTERRUPTS
The ADIF bit is set at the completion of
every conversion, regardless of whether
or not the ADC interrupt is enabled.
/32
T
/2
/8
CY
Set GO/DONE bit
Holding Capacitor is Disconnected from Analog Input (typically 100 ns)
to T
RC
ADC CLOCK PERIOD (T
AD
source has a typical T
Conversion Starts
ANALOG-TO-DIGITAL CONVERSION T
T
AD
1 T
ADCS<2:0>
AD
b9
AD
000
001
010
x11
2 T
)
AD
b8
3 T
AD
AD
b7
time of 4 μs for V
AD
PIC16F882/883/884/886/887
4 T
) V
2-6 μs
100 ns
400 ns
20 MHz
Preliminary
AD
1.6 μs
b6
S
5 T
. DEVICE OPERATING FREQUENCIES (VDD > 3.0V)
(1,4)
AD
(2)
(2)
AD
b5
time.
6 T
DD
ADRESH and ADRESL registers are loaded,
GO bit is cleared,
ADIF bit is set,
Holding capacitor is connected to analog input
AD
b4
> 3.0V.
7 T
2-6 μs
RC
250 ns
Device Frequency (F
1.0 μs
AD
8 MHz
4.0 μs
clock source is only recommended if the
AD
b3
CYCLES
(1,4)
8 T
(2)
(2)
AD
b2
9
T
AD
b1
2-6 μs
500 ns
8.0 μs
10 T
4 MHz
2.0 μs
OSC
AD
b0
(1,4)
(3)
(2)
11
)
DS41291D-page 101
2-6 μs
32.0 μs
8.0 μs
1 MHz
2.0 μs
(1,4)
(3)
(3)
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