PIC12C672-10E/P Microchip Technology, PIC12C672-10E/P Datasheet - Page 251

• Manufacturer Part Number: PIC12C672-10E/P
• Description: IC MCU OTP 2KX14 A/D 8DIP
• Manufacturer: Microchip Technology
• Series: PIC® 12Cr

Specifications of PIC12C672-10E/P

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 10MHz
• Peripherals: POR, WDT
• Number Of I /o: 5
• Program Memory Size: 3.5KB (2K x 14)
• Program Memory Type: OTP
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Processor Series: PIC12C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Maximum Clock Frequency: 10 MHz
• Number Of Programmable I/os: 5
• Number Of Timers: 8
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8
• Data Rom Size: 128 B
• Height: 3.3 mm
• Length: 9.27 mm
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 3 V
• Width: 6.35 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Details

SPI is a trademark of Motorola Corporation.
I
M
2
C is a trademark of Philips Corporation.
1997 Microchip Technology Inc.
Section 16. Basic Sychronous Serial Port (BSSP)
HIGHLIGHTS
This section of the manual contains the following major topics:
16.1 Introduction ..................................................................................................................16-2
16.2 Control Registers .........................................................................................................16-3
16.3 SPI™ Mode..................................................................................................................16-6
16.4 SSP I
16.5 Initialization ................................................................................................................16-23
16.6 Design Tips ................................................................................................................16-24
16.7 Related Application Notes..........................................................................................16-25
16.8 Revision History .........................................................................................................16-26
Note:
Please refer to
use this module.
2
C Operation .....................................................................................................16-15
Appendix C.2
or the device data sheet to determine which devices
DS31016A page 16-1
16