PIC16F628A-E/P Microchip Technology, PIC16F628A-E/P Datasheet - Page 154
![IC MCU FLASH 2KX14 EEPROM 18DIP](/photos/6/76/67657/18-dip_300mil__sml.jpg)
PIC16F628A-E/P
Manufacturer Part Number
PIC16F628A-E/P
Description
IC MCU FLASH 2KX14 EEPROM 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F627A-IP.pdf
(180 pages)
2.PIC16F627A-IP.pdf
(22 pages)
3.PIC16F627A-ISO.pdf
(168 pages)
Specifications of PIC16F628A-E/P
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
18-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
16
Eeprom Size
128 x 8
Ram Size
224 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
224 B
Interface Type
SCI/USART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
16
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
Data Rom Size
128 B
Height
3.3 mm
Length
22.86 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
3 V
Width
6.35 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
I3DBF648 - BOARD DAUGHTER ICEPIC3AC162053 - HEADER INTERFACE ICD,ICD2 18DIPACICE0202 - ADAPTER MPLABICE 18P 300 MIL
Data Converters
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
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PIC16F627A/628A/648A
20-Lead Plastic Shrink Small Outline (SS) – 209 mil, 5.30 mm (SSOP)
DS40044B-page 152
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-150
Drawing No. C04-072
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Foot Length
Lead Thickness
Foot Angle
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
p
n
Dimension Limits
E1
E
Units
A2
E1
A1
A
E
D
B
n
p
L
c
Preliminary
MIN
2
1
.068
.064
.002
.299
.278
.022
.004
.010
.201
0
0
0
D
L
INCHES*
NOM
.026
.073
.068
.006
.309
.207
.284
.030
.007
.013
20
A1
4
5
5
A
MAX
.078
.072
.010
.322
.212
.289
.037
.010
.015
10
10
8
MIN
0.05
0.25
1.73
1.63
7.59
7.06
0.56
0.10
0.00
5.11
0
0
MILLIMETERS
2004 Microchip Technology Inc.
NOM
101.60
0.65
1.85
1.73
0.15
7.85
5.25
7.20
0.75
0.18
0.32
20
5
5
MAX
203.20
A2
1.98
1.83
0.25
8.18
5.38
7.34
0.94
0.25
0.38
10
10
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