PIC16HV785-I/SO Microchip Technology, PIC16HV785-I/SO Datasheet - Page 172

• Manufacturer Part Number: PIC16HV785-I/SO
• Description: IC PIC MCU FLASH 2KX14 20SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16HV785-I/SO

• Core Size: 8-Bit
• Program Memory Size: 3.5KB (2K x 14)
• Oscillator Type: Internal
• Core Processor: PIC
• Speed: 20MHz
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 17
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 5.5 V
• Data Converters: A/D 14x10b
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-SOIC (7.5mm Width)
• Controller Family/series: PIC16HV
• No. Of I/o's: 18
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 128Byte
• Cpu Speed: 20MHz
• Processor Series: PIC16H
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: RS- 232, USB
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 18
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DV164120, DM163029
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 14 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT20SO1-1 - SOCKET TRANS ICE 20DIP TO 20SOICAC162060 - HEADER INTRFC MPLAB ICD2 20PINAC164039 - MODULE SKT PROMATE II 20DIP/SOIC
• Connectivity: -
• Lead Free Status / Rohs Status: Details

PIC16F785/HV785
20-Lead Plastic Quad Flat No Lead Package (ML) 4x4x0.9 mm Body (QFN) – Saw Singulated
DS41249D-page 170
A
* Controlling Parameter
§ Significant Characteristic
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Exposed pad varies according to die attach paddle size.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC equivalent: Not Registered
Drawing No. C04-126
A1
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length §
Contact-to-Exposed Pad §
E
See ASME Y14.5M
See ASME Y14.5M
TOP VIEW
Dimension Limits
D
Units
E2
D2
A3
A1
E
D
K
n
e
A
b
L
MIN
OPTIONAL
INDEX
AREA
(NOTE 1)
.000
.102
.102
.007
.012
.008
.031
Preliminary
2
1
.020 BSC
.008 REF
.157 BSC
.157 BSC
EXPOSED
(NOTE 2)
INCHES
METAL
NOM
A3
PAD
.035
.106
.106
.010
.016
.001
20
–
E2
2
1
MAX
.039
.002
.110
.110
.012
.020
–
n
BOTTOM VIEW
MIN
0.80
0.00
2.60
2.60
0.18
0.30
0.20
MILLIMETERS*
D2
© 2006 Microchip Technology Inc.
0.50 BSC
4.00 BSC
4.00 BSC
0.20 REF
NOM
Revised 09-12-05
0.90
0.02
2.70
2.70
0.25
0.40
20
–
MAX
L
1.00
0.05
2.80
2.80
0.30
0.50
–
b
e
K