PIC16F1827-E/P Microchip Technology, PIC16F1827-E/P Datasheet - Page 351

• Manufacturer Part Number: PIC16F1827-E/P
• Description: MCU PIC 8BIT 4K FLASH 18-DIP
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 16Fr

Specifications of PIC16F1827-E/P

• Core Size: 8-Bit
• Program Memory Size: 7KB (4K x 14)
• Core Processor: PIC
• Speed: 32MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 384 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 18-DIP (0.300", 7.62mm)
• Controller Family/series: PIC16F
• No. Of I/o's: 16
• Eeprom Memory Size: 256Byte
• Ram Memory Size: 384Byte
• Cpu Speed: 32MHz
• No. Of Timers: 5
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 384 B
• Interface Type: I2C, EUSART (SCI), SPI, USB
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 15
• Number Of Timers: 4 x 8 bit, 1 x 16 bit
• Operating Supply Voltage: 5.5 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 12 Channel
• On-chip Dac: 5 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

29.6
© 2009 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C ≤ T
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Legend:
Note 1: I
Param
No.
2: T
3: T
Thermal Considerations
P
DD
INTERNAL
A
J
T
Sym.
P
TBD = To Be Determined
P
JMAX
= Ambient Temperature
= Junction Temperature
θ
θ
PD
DER
is current to run the chip alone without driving any load on the output pins.
JC
I
JA
/
O
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
A
Characteristic
≤ +125°C
Preliminary
Typ.
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
150
—
—
—
—
PIC16F/LF1826/27
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C
W
W
W
W
18-pin PDIP package
18-pin SOIC package
20-pin SSOP package
28-pin UQFN 4x4mm package
28-pin QFN 6x6mm package
18-pin SPDIP package
18-pin SOIC package
20-pin SSOP package
28-pin UQFN 4x4mm package
28-pin QFN 6x6mm package
PD = P
P
P
P
INTERNAL
I
DER
/
O
= Σ (I
= PD
INTERNAL
OL
= I
MAX
* V
DD
Conditions
(T
OL
+ P
x V
J
) + Σ (I
- T
DD
I
/
O
A
DS41391B-page 351
(1)
)/θ
OH
JA
(2)
* (V
DD
- V
OH
))