PIC16F684-E/P Microchip Technology, PIC16F684-E/P Datasheet - Page 179
![IC PIC MCU FLASH 2KX14 14DIP](/photos/6/59/65935/150-14-dip_sml.jpg)
PIC16F684-E/P
Manufacturer Part Number
PIC16F684-E/P
Description
IC PIC MCU FLASH 2KX14 14DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F684-ISL.pdf
(4 pages)
4.PIC16F684-ISL.pdf
(192 pages)
5.PIC16F684-ISL.pdf
(6 pages)
6.PIC16F684-IST.pdf
(164 pages)
Specifications of PIC16F684-E/P
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
14-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
12
Eeprom Size
256 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163014, DM164120-4
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM163029 - BOARD PICDEM FOR MECHATRONICSACICE0207 - MPLABICE 14P 300 MIL ADAPTER
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F684-ISL PDF datasheet #3
- PIC16F684-ISL PDF datasheet #4
- PIC16F684-ISL PDF datasheet #5
- PIC16F684-IST PDF datasheet #6
- Current page: 179 of 192
- Download datasheet (4Mb)
© 2007 Microchip Technology Inc.
16-Lead Plastic Quad Flat, No Lead Package (ML) – 4x4x0.9 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
E
A
A1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
2
1
EXPOSED
NOTE 1
A3
Units
A1
A3
E2
D2
N
A
E
D
K
e
b
L
E2
PAD
1
2
MIN
0.80
0.00
2.50
2.50
0.25
0.30
0.20
MILLIMETERS
BOTTOM VIEW
N
0.65 BSC
0.20 REF
4.00 BSC
4.00 BSC
NOM
0.90
0.02
2.65
2.65
0.30
0.40
16
–
Microchip Technology Drawing C04-127B
D2
PIC16F684
MAX
1.00
0.05
0.50
2.80
2.80
0.35
–
DS41202F-page 177
L
K
b
e
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