ST72F324K2T6 STMicroelectronics, ST72F324K2T6 Datasheet - Page 148
ST72F324K2T6
Manufacturer Part Number
ST72F324K2T6
Description
MCU 8BIT 8K FLASH 5V 32TQFP
Manufacturer
STMicroelectronics
Series
ST7r
Datasheet
1.ST72F324J2T6.pdf
(164 pages)
Specifications of ST72F324K2T6
Core Processor
ST7
Core Size
8-Bit
Speed
8MHz
Connectivity
SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
24
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Ram Size
384 x 8
Voltage - Supply (vcc/vdd)
3.8 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-LQFP
Processor Series
ST72F3x
Core
ST7
Data Bus Width
8 bit
Data Ram Size
384 B
Interface Type
SCI, SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
32
Number Of Timers
4 bit
Operating Supply Voltage
3.8 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST7F521-IND/USB, ST7232X-EVAL, ST7MDT20-DVP3, ST7MDT20J-EMU3, STX-RLINK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
For Use With
497-6421 - BOARD EVAL DGTL BATT CHGR DESIGN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
In Transition
Other names
497-4850
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ST72F324K2T6
Manufacturer:
DLP
Quantity:
53
Company:
Part Number:
ST72F324K2T6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Company:
Part Number:
ST72F324K2T6TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
ST72324Jx ST72324Kx
13.2 THERMAL CHARACTERISTICS
Notes:
1. The power dissipation is obtained from the formula P
and P
2. The average chip-junction temperature can be obtained from the formula T
148/164
1
PORT
Symbol
T
R
Jmax
P
is the port power dissipation determined by the user.
thJA
D
Package thermal resistance (junction to ambient)
Power dissipation
Maximum junction temperature
1)
Ratings
D
=P
2)
INT
+P
PORT
TQFP44 10x10
SDIP42 600mil
SDIP32 200mil
TQFP32 7x7
where P
J
= T
INT
A
is the chip internal power (I
+ P
D
x RthJA.
Value
150
500
52
70
55
50
°C/W
DD
Unit
mW
°C
xV
DD
)