ST72F324BK4T6 STMicroelectronics, ST72F324BK4T6 Datasheet - Page 140
ST72F324BK4T6
Manufacturer Part Number
ST72F324BK4T6
Description
IC MCU 8BIT 16K FLASH 32-LQFP
Manufacturer
STMicroelectronics
Series
ST7r
Datasheet
1.ST72F324BJ2T6.pdf
(198 pages)
Specifications of ST72F324BK4T6
Core Processor
ST7
Core Size
8-Bit
Speed
8MHz
Connectivity
SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
24
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
3.8 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-TQFP, 32-VQFP
Processor Series
ST72F3x
Core
ST7
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
SCI, SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
32
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST7232X-EVAL, ST7MDT20-DVP3, ST7MDT20J-EMU3, STX-RLINK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 12 Channel
For Use With
497-6421 - BOARD EVAL DGTL BATT CHGR DESIGN497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
497-5594
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ST72F324BK4T6
Manufacturer:
STM
Quantity:
1 422
Company:
Part Number:
ST72F324BK4T6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Company:
Part Number:
ST72F324BK4T6TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Instruction set
11.1.7
11.2
140/198
Table 79.
Relative mode (direct, indirect)
This addressing mode is used to modify the PC register value, by adding an 8-bit signed
offset to it.
Table 80.
The relative addressing mode consists of two submodes:
Relative (direct)
The offset follows the opcode.
Relative (indirect)
The offset is defined in the memory, the address of which follows the opcode.
Instruction groups
The ST 7 family devices use an Instruction Set consisting of 63 instructions. The instructions
may be subdivided into 13 main groups as illustrated in the following table:
Table 81.
Short only
JRxx
CALLR
Load and Transfer
Stack operation
Increment/Decrement INC
.
Available relative direct/indirect instructions
Group
Instructions supporting direct, indexed, indirect and indirect indexed
addressing modes
Relative direct and indirect instructions and functions
Instruction groups
Instructions
CLR
INC, DEC
TNZ
CPL, NEG
BSET, BRES
BTJT, BTJF
SLL, SRL, SRA, RLC, RRC
SWAP
CALL, JP
LD
PUSH
Doc ID13466 Rev 4
CLR
POP
DEC
RSP
Clear
Increment/Decrement
Test Negative or Zero
1 or 2 Complement
Bit operations
Bit Test and Jump operations
Shift and Rotate operations
Swap nibbles
Call or Jump sub-routine
Conditional Jump
Call Relative
Instructions
Function
Function
ST72324B-Auto