ST62T00CB6 STMicroelectronics, ST62T00CB6 Datasheet - Page 48

• Manufacturer Part Number: ST62T00CB6
• Description: IC MCU 8BIT OTP 1K 16-PDIP
• Manufacturer: STMicroelectronics
• Series: ST6r

Specifications of ST62T00CB6

• Core Processor: ST6
• Core Size: 8-Bit
• Speed: 8MHz
• Peripherals: LVD, POR, WDT
• Number Of I /o: 9
• Program Memory Size: 1KB (1K x 8)
• Program Memory Type: OTP
• Ram Size: 64 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 6 V
• Data Converters: A/D 4x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-DIP (0.300", 7.62mm)
• Controller Family/series: ST6
• No. Of I/o's: 9
• Ram Memory Size: 64Byte
• Cpu Speed: 8MHz
• No. Of Timers: 1
• Rohs Compliant: Yes
• Processor Series: ST62T0x
• Core: ST6
• Data Bus Width: 8 bit
• Data Ram Size: 64 B
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 9
• Number Of Timers: 2
• Operating Supply Voltage: 3 V to 6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Development Tools By Supplier: ST622XC-KIT/110, ST62GP-EMU2, ST62E2XC-EPB/110, ST62E6XC-EPB/US, STREALIZER-II
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8 bit
• Cpu Family: ST6
• Device Core Size: 8b
• Frequency (max): 8MHz
• Total Internal Ram Size: 64Byte
• # I/os (max): 9
• Number Of Timers - General Purpose: 1
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 6V
• Operating Supply Voltage (min): 3V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Through Hole
• Pin Count: 16
• Package Type: PDIP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: In Transition
• Other names: 497-2093-5

ST62T00C/T01C ST62T03C/E01C
6 ELECTRICAL CHARACTERISTICS
6.1 ABSOLUTE MAXIMUM RATINGS
This product contains devices to protect the inputs
against damage due to high static voltages, how-
ever it is advisable to take normal precaution to
avoid application of any voltage higher than the
specified maximum rated voltages.
For proper operation it is recommended that V
and V
Reliability is enhanced if unused inputs are con-
nected to an appropriate logic voltage level (V
or V
Notes:
- Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and
- (1) Within these limits, clamping diodes are guarantee to be not conductive. Voltages outside these limits are authorised as long as injection
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48
functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
current is kept within the specification.
SS
Symbol
O
IV
T
IV
V
).
V
STG
V
Tj
DD
DD
SS
O
be higher than V
I
Supply Voltage
Input Voltage
Output Voltage
Total Current into V
Total Current out of V
Junction Temperature
Storage Temperature
SS
and lower than V
DD
Parameter
SS
(source)
(sink)
DD
DD
I
.
Power Considerations.The average chip-junc-
tion temperature, Tj, in Celsius can be obtained
from:
Where:TA = Ambient Temperature.
Tj=TA + PD x RthJA
RthJA =Package thermal resistance (junc-
PD = Pint + Pport.
Pint =IDD x VDD (chip internal power).
Pport =Port power dissipation (determined
V
V
SS
SS
tion-to ambient).
by the user).
- 0.3 to V
- 0.3 to V
-0.3 to 7.0
-60 to 150
Value
100
150
80
DD
DD
+ 0.3
+ 0.3
(1)
(1)
Unit
mA
mA
V
V
V
C
C