PIC24HJ12GP202-I/ML Microchip Technology, PIC24HJ12GP202-I/ML Datasheet - Page 226

• Manufacturer Part Number: PIC24HJ12GP202-I/ML
• Description: IC PIC MCU FLASH 4KX24 28QFN
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ12GP202-I/ML

• Core Size: 16-Bit
• Program Memory Size: 12KB (4K x 24)
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Core Processor: PIC
• Speed: 40 MIPs
• Connectivity: I²C, SPI, UART/USART
• Number Of I /o: 21
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Controller Family/series: PIC24
• No. Of I/o's: 21
• Ram Memory Size: 1KB
• Cpu Speed: 40MIPS
• No. Of Timers: 4
• Processor Series: PIC24HJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 1024 B
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 21
• Number Of Timers: 3
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 10 Channel / 12 bit, 10 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164336 - MODULE SOCKET FOR PM3 28/44QFNDV164033 - KIT START EXPLORER 16 MPLAB ICD2
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PIC24HJ12GP201/202
28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN]
with 0.55 mm Contact Length
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
DS70282D-page 224
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
Dimension Limits
1
2
A1
EXPOSED
E
Preliminary
A
NOTE 1
PAD
Units
A1
A3
E2
D2
N
A
E
D
K
e
b
L
E2
2
1
0.80
0.00
3.65
3.65
0.23
0.50
0.20
MIN
N
MILLIMETERS
BOTTOM VIEW
0.65 BSC
0.20 REF
6.00 BSC
6.00 BSC
NOM
0.90
0.02
3.70
3.70
0.30
0.55
D2
28
–
Microchip Technology Drawing C04-105B
© 2009 Microchip Technology Inc.
MAX
1.00
0.05
4.20
4.20
0.35
0.70
–
L
b
K
e