DSPIC30F2011-30I/P Microchip Technology, DSPIC30F2011-30I/P Datasheet - Page 53
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DSPIC30F2011-30I/P
Manufacturer Part Number
DSPIC30F2011-30I/P
Description
IC DSPIC MCU/DSP 12K 18DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F2011-20ISO.pdf
(210 pages)
3.DSPIC30F2011-20ISO.pdf
(14 pages)
4.DSPIC30F2011-20ISO.pdf
(6 pages)
5.DSPIC30F2011-20ISO.pdf
(18 pages)
6.DSPIC30F2011-20IP.pdf
(26 pages)
7.DSPIC30F2012-30ISO.pdf
(205 pages)
Specifications of DSPIC30F2011-30I/P
Program Memory Type
FLASH
Program Memory Size
12KB (4K x 24)
Package / Case
18-DIP (0.300", 7.62mm)
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
12
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
12
Data Ram Size
1 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011, DM300018, DM183021
Minimum Operating Temperature
- 40 C
Package
18PDIP
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
30 MHz
Operating Supply Voltage
3.3|5 V
Interface Type
I2C/SPI/UART
On-chip Adc
8-chx12-bit
Number Of Timers
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC30F005 - MODULE SCKT DSPIC30F 18DIP/SOICDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLEACICE0202 - ADAPTER MPLABICE 18P 300 MIL
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F2011-30IP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F2011-30I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
11.13 Reading the Application ID Word
The application ID word is stored at address 0x8005BE
in executive code memory. To read this memory
location, you must use the SIX control code to move
this program memory location to the VISI register. The
REGOUT control code must then be used to clock the
contents of the VISI register out of the device. The
corresponding control and instruction codes that must
be serially transmitted to the device to perform this
operation are shown in
Once the programmer has clocked-out the application
ID word, it must be inspected. If the application ID has
the value 0xBB, the programming executive is resident
in memory and the device can be programmed using
the mechanism described in
Programming”. However, if the application ID has any
other value, the programming executive is not resident
in memory. It must be loaded to memory before the
device can be programmed. The procedure for loading
the programming executive to the memory is described
in
Executive to
TABLE 11-13: SERIAL INSTRUCTION EXECUTION FOR READING THE APPLICATION ID WORD
© 2010 Microchip Technology Inc.
Step 1: Exit the Reset vector.
0000
0000
0000
Step 2: Initialize TBLPAG and the read pointer (W0) for TBLRD instruction.
0000
0000
0000
0000
0000
0000
0000
0000
Step 3: Output the VISI register using the REGOUT command.
0001
0000
Command
Section 12.0 “Programming the Programming
(Binary)
Memory”.
040100
040100
000000
200800
880190
205BE0
207841
000000
BA0890
000000
000000
<VISI>
000000
(Hexadecimal)
Data
Table
11-13.
Section 5.0 “Device
GOTO 0x100
GOTO 0x100
NOP
MOV
MOV
MOV
MOV
NOP
TBLRDL [W0], [W1]
NOP
NOP
Clock out contents of the VISI register
NOP
#0x80, W0
W0, TBLPAG
#0x5BE, W0
VISI, W1
11.14 Exiting ICSP Mode
After confirming that the programming executive is
resident in memory, or loading the programming
executive, ICSP mode is exited by removing power to
the device or bringing MCLR to V
then take place by following the procedure outlined in
Section 5.0 “Device
Description
Programming”.
IL
. Programming can
DS70102K-page 53