PIC16F636-I/P Microchip Technology, PIC16F636-I/P Datasheet - Page 117
![IC MCU FLASH 2KX14 14DIP](/photos/6/59/65935/150-14-dip_sml.jpg)
PIC16F636-I/P
Manufacturer Part Number
PIC16F636-I/P
Description
IC MCU FLASH 2KX14 14DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC12F635-ISN.pdf
(234 pages)
3.PIC16F636-ISL.pdf
(8 pages)
4.PIC16F636-ISL.pdf
(4 pages)
5.PIC16F636-IST.pdf
(196 pages)
Specifications of PIC16F636-I/P
Program Memory Type
FLASH
Program Memory Size
3.5KB (2K x 14)
Package / Case
14-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, LVD, POR, WDT
Number Of I /o
11
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Interface Type
RS- 232/SPI/USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
2
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120
Minimum Operating Temperature
- 40 C
On-chip Adc
8 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164039 - MODULE SKT PROMATE II 20DIP/SOICAC162057 - MPLAB ICD 2 HEADER 14DIPACICE0207 - MPLABICE 14P 300 MIL ADAPTER
Eeprom Size
-
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC16F616T-ISL PDF datasheet
- PIC12F635-ISN PDF datasheet #2
- PIC16F636-ISL PDF datasheet #3
- PIC16F636-ISL PDF datasheet #4
- PIC16F636-IST PDF datasheet #5
- Current page: 117 of 196
- Download datasheet (4Mb)
12.6
The BODEN0 and BODEN1 bits in the Configuration
Word register select one of four BOD modes. Two
modes have been added to allow software or hardware
control of the BOD enable. When BODEN<1:0> = 01,
the SBODEN bit (PCON<4>) enables/disables the BOD
allowing it to be controlled in software. By selecting
BODEN<1:0>, the BOD is automatically disabled in
Sleep to conserve power and enabled on wake-up. In
this mode, the SBODEN bit is disabled. See
Register 12-1 for the Configuration Word definition.
If V
(T
the Brown-out situation will reset the device. This will
occur regardless of V
ensured to occur if V
parameter (T
FIGURE 12-3:
© 2005 Microchip Technology Inc.
BOD
DD
) (see Section 15.0 “Electrical Specifications”),
falls below V
Brown-out Detect (BOD)
BOD
).
Note 1: Nominal 64 ms delay only if PWRTE bit is programmed to ‘0’.
Internal
Internal
Internal
Reset
Reset
Reset
V
V
V
DD
BOD
DD
DD
DD
DD
BROWN-OUT DETECT SITUATIONS
falls below V
for greater than parameter
slew rate. A Reset is not
BOD
for less than
PIC12F635/PIC16F636/639
Preliminary
< 64 ms
64 ms
On any Reset (Power-on, Brown-out Detect, Watchdog
Timer, etc.), the chip will remain in Reset until V
above V
will now be invoked, if enabled and will keep the chip in
Reset an additional nominal 64 ms.
If V
running, the chip will go back into a Brown-out Detect
and the Power-up Timer will be re-initialized. Once V
rises above V
64 ms Reset.
Note:
(1)
DD
64 ms
64 ms
drops below V
BOD
(1)
(1)
The Power-up Timer is enabled by the
PWRTE bit in the Configuration Word
register.
(see Figure 12-3). The Power-up Timer
BOD
, the Power-up Timer will execute a
BOD
while the Power-up Timer is
V
V
V
BOD
BOD
BOD
DS41232B-page 115
DD
rises
DD
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