C8051F34B-GQ Silicon Laboratories Inc, C8051F34B-GQ Datasheet - Page 36
![IC 8051 MCU 32K FLASH 32LQFP](/photos/12/18/121852/c8051f34b-gq_sml.jpg)
C8051F34B-GQ
Manufacturer Part Number
C8051F34B-GQ
Description
IC 8051 MCU 32K FLASH 32LQFP
Manufacturer
Silicon Laboratories Inc
Series
C8051F34xr
Datasheet
1.C8051F349-GQ.pdf
(276 pages)
Specifications of C8051F34B-GQ
Program Memory Type
FLASH
Program Memory Size
32KB (32K x 8)
Package / Case
32-LQFP
Core Processor
8051
Core Size
8-Bit
Speed
48MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Number Of I /o
25
Ram Size
2.25K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 17x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F3x
Core
8051
Data Bus Width
8 bit
Data Ram Size
2.25 KB
Interface Type
I2C/SMBus/SPI/UART/USB
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
25
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
KSK-SL-F34X, KSK-SL-TOOLSTICK, PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F340DK
Minimum Operating Temperature
- 40 C
Package
32LQFP
Device Core
8051
Family Name
C8051F34x
Maximum Speed
48 MHz
Operating Supply Voltage
3.3|5 V
On-chip Adc
17-chx10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
336-1748 - ADAPTER TOOLSTICK FOR C8051F34X
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1534
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
C8051F34B-GQ
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
Company:
Part Number:
C8051F34B-GQR
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
- Current page: 36 of 276
- Download datasheet (2Mb)
C8051F340/1/2/3/4/5/6/7/8/9/A/B/C/D
36
Notes:
General:
Solder Mask Design:
Stencil Design:
Card Assembly:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all pads.
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020
Figure 4.6. LQFP-32 Recommended PCB Land Pattern
the solder mask and the metal pad is to be 60 µm minimum, all the way around
the pad.
should be used to assure good solder paste release.
specification for Small Body Components.
Table 4.5. LQFP-32 PCB Land Pattern Dimensions
Dimension
C1
C2
X1
Y1
E
Rev. 1.3
8.40
8.40
0.40
1.25
Min
0.80 BSC
Max
8.50
8.50
0.50
1.35
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