LPC2138FHN64/01,55 NXP Semiconductors, LPC2138FHN64/01,55 Datasheet - Page 38

• Manufacturer Part Number: LPC2138FHN64/01,55
• Description: IC ARM7 MCU FLASH 512K 64-HVQFN
• Manufacturer: NXP Semiconductors
• Series: LPC2100r

Specifications of LPC2138FHN64/01,55

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 64-VQFN Exposed Pad, 64-HVQFN, 64-SQFN, 64-DHVQFN
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 60MHz
• Connectivity: I²C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 47
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC21
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 32 KB
• Interface Type: I2C/SPI/SSP/UART
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 47
• Number Of Timers: 2
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, KSK-LPC2138, KSK-LPC2138-PL
• Development Tools By Supplier: OM10045, OM10070, OM10089
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (8-ch x 10-bit)
• On-chip Dac: 1-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 568-4310 - EVAL BOARD LPC2158 W/LCD568-4298 - BOARD EVAL LPC213X KS213X568-4297 - BOARD EVAL LPC21XX MCB2100MCB2130UME - BOARD EVAL MCB2130 + ULINK-MEMCB2130U - BOARD EVAL MCB2130 + ULINK2MCB2130 - BOARD EVAL NXP LPC213X ARM FAM622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K568-2095 - BOARD EVAL FOR LPC213X ARM MCU
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4011; 935281779557; LPC2138FHN64/01

NXP Semiconductors
LPC2131_32_34_36_38
Product data sheet
12.2 RTC 32 kHz oscillator component selection
12.3 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines
The RTC external oscillator circuit is shown in
integrated on chip, only a crystal, the capacitances C
externally to the microcontroller.
Table 12
capacitance of the crystal and is usually specified by the crystal manufacturer. The actual
C
different load capacitance, the circuit will oscillate at a slightly different frequency
(depending on the quality of the crystal) compared to the specified one. Therefore for an
accurate time reference it is advised to use the load capacitors as specified in
that belong to a specific C
this table are calculated from the internal parasitic capacitances and the C
from PCB and package are not taken into account.
Table 12.
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of C
accordingly to the increase in parasitics of the PCB layout.
Crystal load capacitance
C
11 pF
13 pF
15 pF
Fig 15. RTC oscillator modes and models: oscillation mode of operation and external
L
L
influences oscillation frequency. When using a crystal that is manufactured for a
gives the crystal parameters that should be used. C
crystal model used for C
Recommended values for the RTC external 32 kHz oscillator C
All information provided in this document is subject to legal disclaimers.
RTCX1
C X1
LPC2xxx
32 kHz XTAL
Rev. 5 — 2 February 2011
L
Maximum crystal series
resistance R
< 100 kΩ
< 100 kΩ
< 100 kΩ
. The value of external capacitances C
RTCX2
C X2
X1
/C
X2
S
evaluation
x1
LPC2131/32/34/36/38
Figure
and C
Single-chip 16/32-bit microcontrollers
X1
=
15. Since the feedback resistance is
x2
External load capacitors C
18 pF, 18 pF
22 pF, 22 pF
27 pF, 27 pF
and C
should be chosen smaller
L
X2
is the typical load
x1
need to be connected
, C
L
C L
R S
X1
x2
and C
002aaf495
, and C
© NXP B.V. 2011. All rights reserved.
X1
C P
/C
L
X2
. Parasitics
X2
specified in
x3
components
Table 12
in case of
X1
/C
38 of 45
X2