LPC2138FHN64/01,55 NXP Semiconductors, LPC2138FHN64/01,55 Datasheet - Page 12
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LPC2138FHN64/01,55
Manufacturer Part Number
LPC2138FHN64/01,55
Description
IC ARM7 MCU FLASH 512K 64-HVQFN
Manufacturer
NXP Semiconductors
Series
LPC2100r
Specifications of LPC2138FHN64/01,55
Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
64-VQFN Exposed Pad, 64-HVQFN, 64-SQFN, 64-DHVQFN
Core Processor
ARM7
Core Size
16/32-Bit
Speed
60MHz
Connectivity
I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
47
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 16x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC21
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
32 KB
Interface Type
I2C/SPI/SSP/UART
Maximum Clock Frequency
60 MHz
Number Of Programmable I/os
47
Number Of Timers
2
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, KSK-LPC2138, KSK-LPC2138-PL
Development Tools By Supplier
OM10045, OM10070, OM10089
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (8-ch x 10-bit)
On-chip Dac
1-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
568-4310 - EVAL BOARD LPC2158 W/LCD568-4298 - BOARD EVAL LPC213X KS213X568-4297 - BOARD EVAL LPC21XX MCB2100MCB2130UME - BOARD EVAL MCB2130 + ULINK-MEMCB2130U - BOARD EVAL MCB2130 + ULINK2MCB2130 - BOARD EVAL NXP LPC213X ARM FAM622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K568-2095 - BOARD EVAL FOR LPC213X ARM MCU
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4011
935281779557
LPC2138FHN64/01
935281779557
LPC2138FHN64/01
NXP Semiconductors
Table 3.
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
LPC2131_32_34_36_38
Product data sheet
Symbol
P1.26/RTCK
P1.27/TDO
P1.28/TDI
P1.29/TCK
P1.30/TMS
P1.31/TRST
RESET
XTAL1
XTAL2
RTCX1
RTCX2
V
V
V
V
VREF
VBAT
SS
SSA
DD
DDA
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control.
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control. If configured for an input
function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns.
Open drain 5 V tolerant digital I/O I
functionality.
5 V tolerant pad providing digital I/O (with TTL levels and hysteresis and 10 ns slew rate control) and analog input function. If configured
for an input function, this pad utilizes built-in glitch filter that blocks pulses shorter than 3 ns. When configured as an ADC input, digital
section of the pad is disabled.
5 V tolerant pad providing digital I/O (with TTL levels and hysteresis and 10 ns slew rate control) and analog output function. When
configured as the DAC output, digital section of the pad is disabled.
5 V tolerant pad with built-in pull-up resistor providing digital I/O functions with TTL levels and hysteresis and 10 ns slew rate control.
The pull-up resistor’s value ranges from 60 kΩ to 300 kΩ.
5 V tolerant pad providing digital input (with TTL levels and hysteresis) function only.
Pad provides special analog functionality.
When unused, the RTCX1 pin can be grounded or left floating. For lowest power leave it floating.
The other RTC pin, RTCX2, should be left floating.
Pin description
Pin
24
64
60
56
52
20
57
62
61
3
5
6, 18,
25, 42,
50
59
23, 43,
51
7
63
49
[9]
[9]
[6]
[6]
[6]
[6]
[6]
[6]
[7]
[8]
[8]
I
Type
I/O
O
I
I
I
I
I
I
O
I
O
I
I
I
I
I
…continued
2
C-bus 400 kHz specification compatible pad. It requires external pull-up to provide an output
Description
RTCK — Returned Test Clock output. Extra signal added to the JTAG port. Assists
debugger synchronization when processor frequency varies. Bidirectional pin with
internal pull-up. LOW on RTCK while RESET is LOW enables pins P1.31:26 to operate
as Debug port after reset.
TDO — Test Data out for JTAG interface.
TDI — Test Data in for JTAG interface.
TCK — Test Clock for JTAG interface.
TMS — Test Mode Select for JTAG interface.
TRST — Test Reset for JTAG interface.
External reset input: A LOW on this pin resets the device, causing I/O ports and
peripherals to take on their default states, and processor execution to begin at address
0. TTL with hysteresis, 5 V tolerant.
Input to the oscillator circuit and internal clock generator circuits.
Output from the oscillator amplifier.
Input to the RTC oscillator circuit.
Output from the RTC oscillator circuit.
Ground: 0 V reference.
Analog ground: 0 V reference. This should nominally be the same voltage as V
should be isolated to minimize noise and error.
3.3 V power supply: This is the power supply voltage for the core and I/O ports.
Analog 3.3 V power supply: This should be nominally the same voltage as V
should be isolated to minimize noise and error. This voltage is used to power the
on-chip PLL.
ADC reference: This should be nominally the same voltage as V
isolated to minimize noise and error. Level on this pin is used as a reference for A/D
and D/A convertor(s).
RTC power supply: 3.3 V on this pin supplies the power to the RTC.
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 2 February 2011
LPC2131/32/34/36/38
Single-chip 16/32-bit microcontrollers
DD
© NXP B.V. 2011. All rights reserved.
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