LPC3230FET296/01,5 NXP Semiconductors, LPC3230FET296/01,5 Datasheet - Page 15
![IC ARM9 MCU 256K 296-TFBGA](/photos/12/13/121395/lpc3230fet296_01_5_sml.jpg)
LPC3230FET296/01,5
Manufacturer Part Number
LPC3230FET296/01,5
Description
IC ARM9 MCU 256K 296-TFBGA
Manufacturer
NXP Semiconductors
Series
LPC32x0r
Specifications of LPC3230FET296/01,5
Package / Case
296-TFBGA
Core Processor
ARM9
Core Size
16/32-Bit
Speed
266MHz
Connectivity
EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, Motor Control PWM, PWM, WDT
Number Of I /o
51
Program Memory Type
ROMless
Ram Size
256K x 8
Voltage - Supply (vcc/vdd)
0.9 V ~ 3.6 V
Data Converters
A/D 3x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC32
Core
ARM926EJ-S
Data Bus Width
32 bit
Data Ram Size
256 KB
Interface Type
EMC
Maximum Clock Frequency
266 MHz
Number Of Timers
6
Operating Supply Voltage
1.31 V to 1.39 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 3 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4964
935290764551
935290764551
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC3230FET296/01,5
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
4. AC/DC deviations detail
ES_LPC3230
Errata sheet
4.1 ESD.1: Weak ESD protection on Reset_N pad
Introduction:
The LPC3230 was designed to withstand electrostatic discharges up to 2000 V using the
Human Body Model.
Problem:
The RESET_N pad (pin M14) does not pass ESD tests above 1000 V.
Work-around:
Observe proper ESD handling precautions for the RESET_N pin
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 1 February 2011
ES_LPC3230
Errata sheet LPC3230
© NXP B.V. 2011. All rights reserved.
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