PIC24HJ256GP610-I/PF Microchip Technology, PIC24HJ256GP610-I/PF Datasheet - Page 18

IC PIC MCU FLASH 128KX16 100TQFP

PIC24HJ256GP610-I/PF

Manufacturer Part Number
PIC24HJ256GP610-I/PF
Description
IC PIC MCU FLASH 128KX16 100TQFP
Manufacturer
Microchip Technology
Series
PIC® 24Hr

Specifications of PIC24HJ256GP610-I/PF

Program Memory Type
FLASH
Program Memory Size
256KB (85.5K x 24)
Package / Case
100-TQFP, 100-VQFP
Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
85
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b, 32x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC24HJ
Core
PIC
Data Bus Width
16 bit
Data Ram Size
16 KB
Interface Type
3-Wire/I2C/USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
85
Number Of Timers
13
Operating Supply Voltage
0 V to 2.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (32-ch x 12-bit)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1004 - PIC24 BREAKOUT BOARDDM300024 - KIT DEMO DSPICDEM 1.1MA240012 - MODULE PLUG-IN PIC24H 100QFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164323 - MODULE SKT FOR 100TQFP
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC24HJ256GP610-I/PF
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
PIC24HJ256GP610-I/PF
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
PIC24HJXXXGPX06/X08/X10
FIGURE 2-1:
2.2.1
On boards with power traces running longer than six
inches in length, it is suggested to use a tank capacitor
for integrated circuits including MCUs to supply a local
power source. The value of the tank capacitor should
be determined based on the trace resistance that con-
nects the power supply source to the device, and the
maximum current drawn by the device in the applica-
tion. In other words, select the tank capacitor so that it
meets the acceptable voltage sag at the device. Typical
values range from 4.7 µF to 47 µF.
2.3
A low-ESR (< 5 Ohms) capacitor is required on the
V
voltage regulator output voltage. The V
pin must not be connected to V
capacitor between 4.7 µF and 10 µF, 16V connected to
ground. The type can be ceramic or tantalum. Refer to
Section 24.0
additional information.
The placement of this capacitor should be close to the
V
length not exceed one-quarter inch (6 mm). Refer to
Section 21.2 “On-Chip Voltage Regulator” for
details.
DS70175H-page 16
CAP
CAP
Ceramic
V
0.1 µF
DD
R
/V
/V
C
DDCORE
DDCORE
R1
Capacitor on Internal Voltage
Regulator (V
TANK CAPACITORS
10 Ω
MCLR
V
V
SS
DD
. It is recommended that the trace
“Electrical
pin, which is used to stabilize the
RECOMMENDED
MINIMUM CONNECTION
PIC24H
CAP
Ceramic
0.1 µF
/V
Characteristics”
DD
DDCORE
, and must have a
V
V
CAP
DD
SS
Ceramic
0.1 µF
Ceramic
0.1 µF
)
/V
Ceramic
0.1 µF
DDCORE
for
2.4
The MCLR pin provides for two specific device
functions:
• Device Reset
• Device programming and debugging
During device programming and debugging, the
resistance and capacitance that can be added to the
pin must be considered. Device programmers and
debuggers drive the MCLR pin. Consequently,
specific voltage levels (V
transitions must not be adversely affected. Therefore,
specific values of R and C will need to be adjusted
based on the application and PCB requirements.
For
recommended that the capacitor C, be isolated from
the MCLR pin during programming and debugging
operations.
Place the components shown in Figure 2-2 within
one-quarter inch (6 mm) from the MCLR pin.
FIGURE 2-2:
Note 1: R ≤ 10 kΩ is recommended. A suggested
example,
2: R1 ≤ 470Ω will limit any current flowing into
Master Clear (MCLR) Pin
starting value is 10 kΩ. Ensure that the
MCLR pin V
MCLR from the external capacitor C, in the
event of MCLR pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR pin
V
V
IH
DD
R
JP
and V
C
as
IL
shown
EXAMPLE OF MCLR PIN
CONNECTIONS
specifications are met.
IH
R1
© 2009 Microchip Technology Inc.
and V
IH
and V
IL
MCLR
in
specifications are met.
PIC24H
IL
Figure 2-2,
) and fast signal
it
is

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