DSPIC30F4011-30I/P Microchip Technology, DSPIC30F4011-30I/P Datasheet - Page 178
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DSPIC30F4011-30I/P
Manufacturer Part Number
DSPIC30F4011-30I/P
Description
IC DSPIC MCU/DSP 48K 40DIP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20IP.pdf
(26 pages)
2.DSPIC30F4012-30ISO.pdf
(238 pages)
3.DSPIC30F4012-30ISO.pdf
(18 pages)
4.DSPIC30F4012-30ISO.pdf
(6 pages)
5.DSPIC30F4012-30ISO.pdf
(16 pages)
6.DSPIC30F4012-30ISO.pdf
(22 pages)
7.DSPIC30F4011-30IP.pdf
(228 pages)
Specifications of DSPIC30F4011-30I/P
Program Memory Type
FLASH
Program Memory Size
48KB (16K x 24)
Package / Case
40-DIP (0.600", 15.24mm)
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
30
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 9x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
30
Data Ram Size
2 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM300018, DM330011
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC30F003 - MODULE SOCKET DSPIC30F 40DIPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLEACICE0206 - ADAPTER MPLABICE 40P 600 MIL
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F4011-30IP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F4011-30I/P
Manufacturer:
CJ
Quantity:
600 000
Part Number:
DSPIC30F4011-30I/P
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Company:
Part Number:
DSPIC30F4011-30I/PT
Manufacturer:
ATMEL
Quantity:
3 000
Company:
Part Number:
DSPIC30F4011-30I/PT
Manufacturer:
MICROCHIP
Quantity:
455
Company:
Part Number:
DSPIC30F4011-30I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC30F4011-30I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
dsPIC30F4011/4012
24.1
TABLE 24-1:
TABLE 24-2:
TABLE 24-3:
DS70135G-page 178
dsPIC30F401X-30I
dsPIC30F401X-20E
Power Dissipation:
Internal Chip Power Dissipation:
P
I/O Pin power dissipation:
P
Maximum Allowed Power Dissipation
Package Thermal Resistance, 28-pin SPDIP (SP)
Package Thermal Resistance, 28-pin SOIC (SO)
Package Thermal Resistance, 40-pin PDIP (P)
Package Thermal Resistance, 44-pin TQFP, 10x10x1 mm (PT)
Package Thermal Resistance, 44-pin QFN (ML)
Note 1:
INT
I
/
O
= ∑ ({V
= V
V
DD
4.5-5.5V
4.5-5.5V
3.0-3.6V
3.0-3.6V
2.5-3.0V
Operating Junction Temperature Range
DC Characteristics
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
DD X
Junction to ambient thermal resistance, Theta-ja (θ
DD
Range
(I
– V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
OH
– ∑ I
}
X
OH
I
OH
)
Characteristic
) + ∑ (V
Rating
-40°C to +125°C
-40°C to +125°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
Temp Range
OL X
I
OL
)
dsPIC30F401X-30I
JA
) numbers are achieved by package simulations.
Symbol
Symbol
30
—
20
—
10
P
DMAX
θ
θ
θ
θ
θ
P
T
T
T
T
JA
JA
JA
JA
JA
A
A
D
J
J
Min
Typ
Max MIPS
-40
-40
-40
-40
41
45
37
40
28
(T
© 2010 Microchip Technology Inc.
P
J
INT
– T
Max
Typ
dsPIC30F401X-20E
—
—
—
—
—
—
—
—
—
+ P
A
)/θ
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+150
+125
20
15
—
—
—
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1