PIC16F84A-20I/SS Microchip Technology, PIC16F84A-20I/SS Datasheet - Page 21
![IC MCU FLASH 1KX14 EE 20SSOP](/photos/6/58/65895/150-20-ssop_sml.jpg)
PIC16F84A-20I/SS
Manufacturer Part Number
PIC16F84A-20I/SS
Description
IC MCU FLASH 1KX14 EE 20SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F688T-ISL.pdf
(688 pages)
2.PIC16F84A-04P.pdf
(88 pages)
3.PIC16F84A-04P.pdf
(6 pages)
Specifications of PIC16F84A-20I/SS
Core Size
8-Bit
Program Memory Size
1.75KB (1K x 14)
Core Processor
PIC
Speed
20MHz
Peripherals
POR, WDT
Number Of I /o
13
Program Memory Type
FLASH
Eeprom Size
64 x 8
Ram Size
68 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
20-SSOP
Controller Family/series
PIC16F
No. Of I/o's
13
Eeprom Memory Size
64Byte
Ram Memory Size
68Byte
Cpu Speed
20MHz
No. Of Timers
1
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
68 B
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
13
Number Of Timers
8
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000
Minimum Operating Temperature
- 40 C
Data Rom Size
64 B
Height
1.75 mm
Length
7.2 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4 V
Width
5.3 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT20SS1-1 - SOCKET TRANSITION 20DIP 20SSOPI3-DB16F84A - BOARD DAUGHTER ICEPIC3AC164307 - MODULE SKT FOR PM3 28SSOPAC164018 - MODULE SKT PROMATEII 20SSOP
Data Converters
-
Connectivity
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F84A-20I/SS
Manufacturer:
MICROCHIP
Quantity:
2 560
Part Number:
PIC16F84A-20I/SS
Manufacturer:
MIC
Quantity:
20 000
- Current page: 21 of 688
- Download datasheet (3Mb)
1.5.3
1997 Microchip Technology Inc.
Packaging Varieties
Depending on the development phase of your project, one of three package types would be used:
The first is a device with an erasure window. Typically these are found in packages with a ceramic
body. These devices are used for the development phase, since the device’s program memory
can be erased and reprogrammed many times.
The second package type is a low cost plastic package. This package type is used in production
where device cost is to be kept to a minimum.
Lastly, there is the DIE option. A DIE is an unpackaged device that has been tested. DIEs are
used in low cost designs and designs where board space is at a minimum.
quick summary of this.
Table 1-3:
Windowed
Plastic
DIE
Package Type
Typical Package Uses
Typical Usage
Development Mode
Production
Special Applications, such as those which require minimum board space
Section 1. Introduction
Table 1-3
DS31001A-page 1-9
shows a
1
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