PIC24FJ64GA104-I/PT Microchip Technology, PIC24FJ64GA104-I/PT Datasheet - Page 114

• Manufacturer Part Number: PIC24FJ64GA104-I/PT
• Description: IC PIC MCU FLASH 64KB 44-TQFP
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 24Fr

Specifications of PIC24FJ64GA104-I/PT

• Core Size: 16-Bit
• Program Memory Size: 64KB (22K x 24)
• Core Processor: PIC
• Speed: 32MHz
• Connectivity: I²C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 35
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 13x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-TQFP, 44-VQFP
• Controller Family/series: PIC24
• Ram Memory Size: 8KB
• Cpu Speed: 32MHz
• No. Of Timers: 5
• Interface: I2C, LIN, SPI, USART
• No. Of Pwm Channels: 5
• Embedded Interface Type: I2C, LIN, SPI, USART
• Rohs Compliant: Yes
• Processor Series: PIC24FJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, IrDA, SPI, UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 35
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, DM240001, MA240020, DM240002, DM240011, DV164033
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 13 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARD
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PIC24FJ64GA104 FAMILY
9.2.4.10
V
ing from Deep Sleep functionally looks like a POR, the
technique described in Section 9.2.4.9 “Checking
and Clearing the Status of Deep Sleep” should be
used to distinguish between Deep Sleep and a true
POR event.
When a true POR occurs, the entire device, including
all Deep Sleep logic (Deep Sleep registers, RTCC,
DSWDT, etc.) is reset.
DS39951B-page 112
DD
voltage is monitored to produce PORs. Since exit-
Power-on Resets (
PORs
)
Preliminary
9.2.4.11
To review, these are the necessary steps involved in
invoking and exiting Deep Sleep mode:
1.
2.
3.
4.
5.
6.
7.
8.
9.
10. The DSEN bit is automatically cleared.
11. Read and clear the DPSLP status bit in RCON,
12. Read the DSGPRx registers (optional).
13. Once all state related configurations are
14. Application resumes normal operation.
Device exits Reset and begins to execute its
application code.
If DSWDT functionality is required, program the
appropriate Configuration bit.
Select the appropriate clock(s) for the DSWDT
and RTCC (optional).
Enable and configure the RTCC (optional).
Write context data to the DSGPRx registers
(optional).
Enable the INT0 interrupt (optional).
Set the DSEN bit in the DSCON register.
Enter Deep Sleep by issuing a PWRSV
#SLEEP_MODE command.
Device exits Deep Sleep when a wake-up event
occurs.
and the DSWAKE status bits.
complete, clear the RELEASE bit.
Summary of Deep Sleep Sequence
© 2009 Microchip Technology Inc.