DSPIC30F1010-30I/SO Microchip Technology, DSPIC30F1010-30I/SO Datasheet - Page 5

IC DSPIC MCU/DSP 6K 28SOIC

DSPIC30F1010-30I/SO

Manufacturer Part Number
DSPIC30F1010-30I/SO
Description
IC DSPIC MCU/DSP 6K 28SOIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F1010-30I/SO

Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
6KB (2K x 24)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-SOIC (7.5mm Width)
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240002, DM300023, DM330011
Package
28SOIC W
Device Core
dsPIC
Family Name
dsPIC30
Maximum Speed
30 MHz
Operating Supply Voltage
3.3|5 V
Number Of Programmable I/os
21
Interface Type
I2C/SPI/UART
On-chip Adc
6-chx10-bit
Number Of Timers
2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
DM300023 - KIT DEMO DSPICDEM SMPS BUCKDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F1010-30I/SO
Manufacturer:
Microchip Technology
Quantity:
135
Part Number:
DSPIC30F1010-30I/SO
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
Company:
Part Number:
DSPIC30F1010-30I/SO
Quantity:
55
5.0
5.1
Once the programming executive has been verified
in memory (or loaded if not present), the dsPIC30F
SMPS can be programmed using the command set
shown in
command is provided in
Executive
TABLE 5-1:
A high-level overview of the programming process is
illustrated in
entering Enhanced ICSP mode. The chip is then bulk
erased, which clears all memory to ‘1’ and allows the
device to be programmed. The Chip Erase is verified
before programming begins. Next, the code memory,
data Flash and Configuration bits are programmed. As
these memories are programmed, they are each
verified to ensure that programming was successful. If
no errors are detected, the programming is complete
and Enhanced ICSP mode is exited. If any of the
verifications fail, the procedure should be repeated,
starting from the Chip Erase.
© 2010 Microchip Technology Inc.
SCHECK
READD
READP
PROGP
PROGC
ERASEB
ERASEP
QBLANK
QVER
Command
DEVICE PROGRAMMING
Overview of the Programming
Process
Table
Commands”.
Sanity check
Read Configuration registers and
device ID
Read code memory
Program one row of code memory and
verify
Program Configuration bits and verify
Bulk Erase or Segment Erase
Erase code memory
Query if the code memory is blank
Query the software version
Figure
5-1. A detailed description for each
COMMAND SET SUMMARY
5-1. The process begins by
Section 8.0 “Programming
Description
FIGURE 5-1:
Program and verify
registers to default
Configuration bits
Enter Enhanced
Program config
ICSP™ Mode
Program and
Program and
Exit Enhanced
Perform chip
verify code
verify data
ICSP Mode
Finish
PROGRAMMING FLOW
Start
erase
value
DS70284C-page 5

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