PIC18F27J13-I/SP Microchip Technology, PIC18F27J13-I/SP Datasheet - Page 495
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC18F27J13-I/SP
Manufacturer Part Number
PIC18F27J13-I/SP
Description
IC PIC MCU 128KB FLASH 28SPDIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC18LF24J10-ISS.pdf
(32 pages)
2.PIC18F26J13-ISS.pdf
(496 pages)
3.PIC18F26J13-ISS.pdf
(558 pages)
4.PIC18F26J13-ISS.pdf
(12 pages)
Specifications of PIC18F27J13-I/SP
Core Size
8-Bit
Program Memory Size
128KB (64K x 16)
Core Processor
PIC
Speed
48MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Type
FLASH
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
2.15 V ~ 3.6 V
Data Converters
A/D 10x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Controller Family/series
PIC18
Cpu Speed
48MHz
Digital Ic Case Style
DIP
Supply Voltage Range
1.8V To 5.5V
Embedded Interface Type
I2C, SPI, USART
Rohs Compliant
Yes
Core
PIC
Processor Series
PIC18F
Data Bus Width
8 bit
Maximum Clock Frequency
48 MHz
Data Ram Size
3.76 KB
On-chip Adc
Yes
Number Of Programmable I/os
2
Number Of Timers
8
Operating Supply Voltage
2.15 V to 3.6 V
Operating Temperature Range
- 40 C to + 85 C
A/d Bit Size
12 bit
A/d Channels Available
10
Height
3.43 mm
Interface Type
I2C, SPI, USART
Length
34.4 mm
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Supply Voltage (max)
3.6 V
Supply Voltage (min)
2.15 V
Width
7.24 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MA180030 - BOARD DEMO PIC18F47J13 FS USBMA180029 - BOARD DEMO PIC18F47J53 FS USB
Eeprom Size
-
Lead Free Status / Rohs Status
Details
- PIC18LF24J10-ISS PDF datasheet
- PIC18F26J13-ISS PDF datasheet #2
- PIC18F26J13-ISS PDF datasheet #3
- PIC18F26J13-ISS PDF datasheet #4
- Current page: 495 of 496
- Download datasheet (5Mb)
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
2010 Microchip Technology Inc.
Device:
Tape and Reel
Option:
Temperature
Range:
Package:
Pattern:
PART NO.
Device
Tape and Reel
Option
PIC18F46K22, PIC18LF46K22
PIC18F45K22, PIC18LF45K22
PIC18F44K22, PIC18LF44K22
PIC18F43K22, PIC18LF43K22
PIC18F26K22, PIC18LF26K22
PIC18F25K22, PIC18LF25K22
PIC18F24K22, PIC18LF24K22
PIC18F23K22, PIC18LF23K22
blank = standard packaging (tube or tray)
T = Tape and Reel
E
I
ML
MV
P
PT
SO
SP
SS
QTP, SQTP, Code or Special Requirements
(blank otherwise)
[X]
(2)
=
=
=
=
=
=
=
= -40C to +125C
= -40C to +85C
QFN
UQFN
PDIP
TQFP (Thin Quad Flatpack)
SOIC
Skinny Plastic DIP
SSOP
-
Temperature
(1, 2)
Range
X
(Extended)
(Industrial)
Package
/XX
Preliminary
Pattern
XXX
PIC18(L)F2X/4XK22
Examples:
a)
b)
c)
d)
Note 1:
PIC18F46K22-E/P 301 = Extended temp.,
PDIP package, QTP pattern #301.
PIC18F46K22-I/SO = Industrial temp., SOIC
package.
PIC18F46K22-E/P = Extended temp., PDIP
package.
PIC18F46K22T-I/ML
Industrial temp., QFN package.
2:
Tape and Reel option is available for ML,
MV, PT, SO and SS packages with industrial
Temperature Range only.
Tape and Reel identifier only appears in
catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package.
.
=
Tape
DS41412D-page 495
and
reel,
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