PIC24FJ32GB002-I/SO Microchip Technology, PIC24FJ32GB002-I/SO Datasheet - Page 304

• Manufacturer Part Number: PIC24FJ32GB002-I/SO
• Description: IC MCU 16BIT 32KB FLASH 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 24Fr

Specifications of PIC24FJ32GB002-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 32KB (11K x 24)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 16-Bit
• Speed: 32MHz
• Connectivity: I²C, IrDA, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Number Of I /o: 19
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 9x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC24FJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C/IrDA/SPI/UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 19
• Number Of Timers: 5
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, DM240001, MA240019, DM240002, DM240011, DV164033
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 9-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC24FJ64GB004 FAMILY
29.1
FIGURE 29-1:
TABLE 29-1:
TABLE 29-2:
DS39940C-page 302
PIC24FJ64GB004 Family:
Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 300 mil SOIC
Package Thermal Resistance, 6x6x0.9 mm QFN
Package Thermal Resistance, 8x8x1 mm QFN
Package Thermal Resistance, 10x10x1 mm TQFP
Note 1:
Operating Junction Temperature Range
Operating Ambient Temperature Range
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
For frequencies between 16 MHz and 32 MHz, F
Note 1:
DC Characteristics
P
P
INT
I
/
O
Junction to ambient thermal resistance; Theta-
= Σ ({V
= V
DD
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
When the voltage regulator is disabled, V
V
x (I
DD
DDCORE
3.00V
2.75V
2.50V
2.35V
2.00V
PIC24FJ64GB004 FAMILY VOLTAGE-FREQUENCY GRAPH (INDUSTRIAL)
DD
– V
Characteristic
– Σ I
OH
} x I
≤ V
Rating
OH
DD
OH
)
16 MHz
) + Σ (V
≤ 3.6V.
OL
x I
PIC24FJ64GB004 Family
OL
Preliminary
)
Frequency
MAX
JA
DD
(θ
= (45.7 MHz/V) * (V
JA
and V
) numbers are achieved by package simulations.
Symbol
Symbol
P
DDCORE
DMAX
θ
θ
θ
θ
P
T
T
JA
JA
JA
JA
A
D
J
must be maintained so that
33.7
39.3
Min
Typ
-40
-40
49
28
DDCORE
(T
© 2009 Microchip Technology Inc.
P
32 MHz
J
INT
– T
Max
– 2V) + 16 MHz.
Typ
—
—
—
—
—
—
+ P
A
)/θ
2.75V
2.35V
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
+125
Max
Unit
+85
(Note 1)
(Note 1)
(Note 1)
(Note 1)
Notes
Unit
°C
°C
W
W