DSPIC33FJ12MC202-I/SO Microchip Technology, DSPIC33FJ12MC202-I/SO Datasheet - Page 232

• Manufacturer Part Number: DSPIC33FJ12MC202-I/SO
• Description: IC DSPIC MCU/DSP 12K 28SOIC
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ12MC202-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 12KB (12K x 8)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I²C, IrDA, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 21
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC33F
• Core: dsPIC
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 21
• Data Ram Size: 1 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240002, DM330021, DM330011
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164339 - MODULE SKT FOR PM3 28SOICDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

dsPIC33FJ12MC201/202
23.1
TABLE 23-1:
TABLE 23-2:
TABLE 23-3:
DS70265B-page 230
Characteristic
Industrial Temperature Devices
Extended Temperature Devices
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 20-pin PDIP
Package Thermal Resistance, 28-pin SPDIP
Package Thermal Resistance, 20-pin SSOP
Package Thermal Resistance, 28-pin SOIC
Package Thermal Resistance, 28-pin QFN
Note 1:
DC Characteristics
P
I/O = Σ ({V
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
INT
Junction to ambient thermal resistance, Theta-
= V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
x (I
– V
V
DD
(in Volts)
DD
3.0-3.6V
3.0-3.6V
OH
Characteristic
– Σ I
Range
} x I
Rating
OH
OH
)
) + Σ (V
OL
x I
OL
-40°C to +125°C
)
Preliminary
-40°C to +85°C
Temp Range
(in °C)
JA
(
θ
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
θ
θ
θ
θ
θ
P
T
T
T
T
JA
JA
JA
JA
JA
A
A
D
J
J
62.4
80.2
Min
Typ
108
-40
-40
-40
-40
60
32
dsPIC33FJ12MC201/202
(T
© 2007 Microchip Technology Inc.
P
J
INT
– T
Max
Typ
Max MIPS
—
—
—
—
—
—
—
—
—
+ P
A
)/θ
40
35
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+140
+125
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1