PIC16F872-I/SO Microchip Technology, PIC16F872-I/SO Datasheet - Page 76

• Manufacturer Part Number: PIC16F872-I/SO
• Description: IC MCU FLASH 2KX14 EE 28SOIC
• Manufacturer: Microchip Technology
• Series: PIC® 16Fr

Specifications of PIC16F872-I/SO

• Program Memory Type: FLASH
• Program Memory Size: 3.5KB (2K x 14)
• Package / Case: 28-SOIC (7.5mm Width)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Eeprom Size: 64 x 8
• Ram Size: 128 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Processor Series: PIC16F
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 128 B
• Interface Type: I2C/SPI/SSP
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 22
• Number Of Timers: 3
• Operating Supply Voltage: 4 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5-ch x 10-bit
• Package: 28SOIC W
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 20 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: XLT28SO-1 - SOCKET TRANSITION 28SOIC 300MIL309-1073 - ADAPTER 28-SOIC TO 28-SOIC309-1024 - ADAPTER 28-SOIC TO 28-DIP309-1023 - ADAPTER 28-SOIC TO 28-DIP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC16F872
9.2.18.1
During a START condition, a bus collision occurs if:
a)
b)
During a START condition, both the SDA and the SCL
pins are monitored. If either the SDA pin or the SCL pin
is already low, then these events all occur:
• the START condition is aborted,
• and the BCLIF flag is set
• and the SSP module is reset to its IDLE state
The START condition begins with the SDA and SCL
pins de-asserted. When the SDA pin is sampled high,
the baud rate generator is loaded from SSPADD<6:0>
and counts down to 0. If the SCL pin is sampled low
while SDA is high, a bus collision occurs, because it is
assumed that another master is attempting to drive a
data '1' during the START condition.
FIGURE 9-20:
DS30221C-page 74
(Figure 9-20).
SDA
SCL
SEN
BCLIF
S
SSPIF
SDA or SCL are sampled low at the beginning of
the START condition (Figure 9-20).
SCL is sampled low before SDA is asserted low.
(Figure 9-21).
Bus Collision During a START
Condition
BUS COLLISION DURING START CONDITION (SDA ONLY)
condition if SDA = 1, SCL=1
Set SEN, enable START
SDA sampled low before
START condition.
S bit and SSPIF set because
SDA = 0, SCL = 1.
SDA goes low before the SEN bit is set.
Set BCLIF,
S bit and SSPIF set because
SDA = 0, SCL = 1.
Set BCLIF.
SSPIF and BCLIF are
cleared in software
If the SDA pin is sampled low during this count, the
BRG is reset and the SDA line is asserted early
(Figure 9-22). If, however, a '1' is sampled on the SDA
pin, the SDA pin is asserted low at the end of the BRG
count. The baud rate generator is then reloaded and
counts down to 0. During this time, if the SCL pins are
sampled as '0', a bus collision does not occur. At the
end of the BRG count, the SCL pin is asserted low.
Note:
SEN cleared automatically because of bus collision.
SSP module reset into IDLE state.
The reason that bus collision is not a factor
during a START condition, is that no two
bus masters can assert a START condition
at the exact same time. Therefore, one
master will always assert SDA before the
other. This condition does not cause a bus
collision, because the two masters must be
allowed to arbitrate the first address follow-
ing the START condition. If the address is
the same, arbitration must be allowed to
continue into the data portion, Repeated
START or STOP conditions.
SSPIF and BCLIF are
cleared in software
© 2006 Microchip Technology Inc.