PIC16C711-04/P Microchip Technology, PIC16C711-04/P Datasheet - Page 158

• Manufacturer Part Number: PIC16C711-04/P
• Description: IC MCU OTP 1KX14 A/D 18DIP
• Manufacturer: Microchip Technology
• Series: PIC® 16Cr

Specifications of PIC16C711-04/P

• Program Memory Type: OTP
• Program Memory Size: 1.75KB (1K x 14)
• Package / Case: 18-DIP (0.300", 7.62mm)
• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 4MHz
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number Of I /o: 13
• Ram Size: 68 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 6 V
• Data Converters: A/D 4x8b
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Processor Series: PIC16C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 68 B
• Maximum Clock Frequency: 4 MHz
• Number Of Programmable I/os: 13
• Number Of Timers: 1
• Maximum Operating Temperature: + 70 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: ICE2000
• Minimum Operating Temperature: 0 C
• On-chip Adc: 4-ch x 8-bit
• Package: 18PDIP
• Device Core: PIC
• Family Name: PIC16
• Maximum Speed: 4 MHz
• Operating Supply Voltage: 5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: ISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMING309-1059 - ADAPTER 18 ZIF BD W/18SO PLUGSDVA16XP180 - ADAPTER DEVICE FOR MPLAB-ICEAC164010 - MODULE SKT PROMATEII DIP/SOIC
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC16C71X
17.4
Note 1: Dimensions D1 and E1 do not include mold protrusion. Allowable mold protrusion is 0.25m/m (0.010”) per
DS30272A-page 158
Symbol
2: Dimension “b” does not include Dambar protrusion, allowable Dambar protrusion shall be 0.08m/m
3: This outline conforms to JEDEC MS-026.
CP
A1
C
D
H
N
A
B
E
e
L
20-Lead Plastic Surface Mount (SSOP - 209 mil Body 5.30 mm) (SS)
side. D1 and E1 dimensions including mold mismatch.
(0.003”)max.
Index
area
CP
E
1 2 3
N
1.730
0.050
0.250
0.130
7.070
5.200
0.650
7.650
0.550
Min
20
0
-
e
D
Millimeters
1.990
0.210
0.380
0.220
7.330
5.380
0.650
7.900
0.950
0.102
Max
B
20
8
Package Group: Plastic SSOP
A1
H
A
Reference
Notes
Base plane
Seating plane
0.068
0.002
0.010
0.005
0.278
0.205
0.026
0.301
0.022
L
Min
20
0
-
Inches
1997 Microchip Technology Inc.
0.078
0.008
0.015
0.009
0.289
0.212
0.026
0.311
0.037
0.004
Max
20
8
Reference
Notes
C