ATMEGA8L-8MU Atmel, ATMEGA8L-8MU Datasheet - Page 2

• Manufacturer Part Number: ATMEGA8L-8MU
• Description: IC AVR MCU 8K 8MHZ 3V 32-QFN
• Manufacturer: Atmel
• Series: AVR® ATmegar

Specifications of ATMEGA8L-8MU

• Core Processor: AVR
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 23
• Program Memory Size: 8KB (4K x 16)
• Program Memory Type: FLASH
• Eeprom Size: 512 x 8
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-VQFN Exposed Pad, 32-HVQFN, 32-SQFN, 32-DHVQFN
• Package: 32MLF EP
• Device Core: AVR
• Family Name: ATmega
• Maximum Speed: 8 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 8 Bit
• Number Of Programmable I/os: 23
• Interface Type: SPI/TWI/USART
• On-chip Adc: 8-chx10-bit
• Number Of Timers: 3
• Controller Family/series: AVR MEGA
• No. Of I/o's: 23
• Eeprom Memory Size: 512Byte
• Ram Memory Size: 1KB
• Cpu Speed: 8MHz
• Rohs Compliant: Yes
• For Use With: ATSTK600-TQFP32 - STK600 SOCKET/ADAPTER 32-TQFPATSTK600-DIP40 - STK600 SOCKET/ADAPTER 40-PDIP770-1007 - ISP 4PORT ATMEL AVR MCU SPI/JTAGATAVRISP2 - PROGRAMMER AVR IN SYSTEMATSTK500 - PROGRAMMER AVR STARTER KIT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Pin
Configurations
2486ZS–AVR–02/11
(XTAL1/TOSC1) PB6
(XTAL2/TOSC2) PB7
(XTAL1/TOSC1) PB6
(XTAL2/TOSC2) PB7
(XCK/T0) PD4
(XCK/T0) PD4
(INT1) PD3
(INT1) PD3
(XTAL1/TOSC1) PB6
(XTAL2/TOSC2) PB7
GND
GND
GND
GND
VCC
VCC
VCC
VCC
(XCK/T0) PD4
(RESET) PC6
(INT0) PD2
(INT1) PD3
(AIN0) PD6
(AIN1) PD7
(ICP1) PB0
(RXD) PD0
(TXD) PD1
(T1) PD5
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
GND
VCC
TQFP Top View
MLF Top View
1
2
3
4
5
6
7
8
9
10
11
12
13
14
PDIP
28
27
26
25
24
23
22
21
20
19
18
17
16
15
PC5 (ADC5/SCL)
PC4 (ADC4/SDA)
PC3 (ADC3)
PC2 (ADC2)
PC1 (ADC1)
PC0 (ADC0)
GND
AREF
AVCC
PB5 (SCK)
PB4 (MISO)
PB3 (MOSI/OC2)
PB2 (SS/OC1B)
PB1 (OC1A)
24
23
22
21
20
19
18
17
24
23
22
21
20
19
18
17
NOTE:
The large center pad underneath the MLF
packages is made of metal and internally
connected to GND. It should be soldered
or glued to the PCB to ensure good
mechanical stability. If the center pad is
left unconneted, the package might
loosen from the PCB.
PC1 (ADC1)
PC0 (ADC0)
ADC7
GND
AREF
ADC6
AVCC
PB5 (SCK)
PC1 (ADC1)
PC0 (ADC0)
ADC7
GND
AREF
ADC6
AVCC
PB5 (SCK)
ATmega8(L)
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