PIC18LF14K22-I/P Microchip Technology, PIC18LF14K22-I/P Datasheet - Page 31
![IC PIC MCU FLASH 512KX16 20-PDIP](/photos/12/13/121303/150-20-dip_sml.jpg)
PIC18LF14K22-I/P
Manufacturer Part Number
PIC18LF14K22-I/P
Description
IC PIC MCU FLASH 512KX16 20-PDIP
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC18LF13K22-ISS.pdf
(388 pages)
2.PIC18LF13K22-ISS.pdf
(12 pages)
3.PIC18LF13K22-ISS.pdf
(36 pages)
4.PIC18LF14K22-IP.pdf
(382 pages)
Specifications of PIC18LF14K22-I/P
Program Memory Type
FLASH
Program Memory Size
16KB (8K x 16)
Package / Case
20-DIP (0.300", 7.62mm)
Core Processor
PIC
Core Size
8-Bit
Speed
64MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
17
Eeprom Size
256 x 8
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
512 B
Interface Type
I2C, MSSP, SPI, USART
Maximum Clock Frequency
32 KHz
Number Of Programmable I/os
18
Number Of Timers
4
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 12 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
- PIC18LF13K22-ISS PDF datasheet
- PIC18LF13K22-ISS PDF datasheet #2
- PIC18LF13K22-ISS PDF datasheet #3
- PIC18LF14K22-IP PDF datasheet #4
- Current page: 31 of 382
- Download datasheet (6Mb)
3.2
3.2.1
The microcontroller clock input, whether from an
internal or external source, is internally divided by four
to generate four non-overlapping quadrature clocks
(Q1, Q2, Q3 and Q4). Internally, the program counter is
incremented on every Q1; the instruction is fetched
from the program memory and latched into the
instruction register during Q4. The instruction is
decoded and executed during the following Q1 through
Q4. The clocks and instruction execution flow are
shown in Figure 3-3.
FIGURE 3-3:
EXAMPLE 3-3:
© 2009 Microchip Technology Inc.
1. MOVLW 55h
2. MOVWF PORTB
3. BRA
4. BSF
5. Instruction @ address SUB_1
All instructions are single cycle, except for any program branches. These take two cycles since the fetch instruction
is “flushed” from the pipeline while the new instruction is being fetched and then executed.
OSC2/CLKOUT
(RC mode)
PIC18 Instruction Cycle
SUB_1
CLOCKING SCHEME
PORTA, BIT3 (Forced NOP)
OSC1
PC
Q1
Q2
Q3
Q4
CLOCK/INSTRUCTION CYCLE
Q1
INSTRUCTION PIPELINE FLOW
Execute INST (PC – 2)
Fetch INST (PC)
Q2
Fetch 1
T
PC
CY
0
Q3
Q4
Execute 1
Fetch 2
T
CY
1
Q1
Preliminary
Fetch INST (PC + 2)
Execute INST (PC)
PIC18F1XK22/LF1XK22
Execute 2
Q2
Fetch 3
PC + 2
T
CY
2
3.2.2
An “Instruction Cycle” consists of four Q cycles: Q1
through Q4. The instruction fetch and execute are
pipelined in such a manner that a fetch takes one
instruction cycle, while the decode and execute take
another instruction cycle. However, due to the
pipelining, each instruction effectively executes in one
cycle. If an instruction causes the program counter to
change (e.g., GOTO), then two cycles are required to
complete the instruction (Example 3-3).
A fetch cycle begins with the Program Counter (PC)
incrementing in Q1.
In the execution cycle, the fetched instruction is latched
into the Instruction Register (IR) in cycle Q1. This
instruction is then decoded and executed during the
Q2, Q3 and Q4 cycles. Data memory is read during Q2
(operand read) and written during Q4 (destination
write).
Q3
Q4
Execute 3
Fetch 4
T
CY
INSTRUCTION FLOW/PIPELINING
3
Q1
Execute INST (PC + 2)
Fetch INST (PC + 4)
Fetch SUB_1 Execute SUB_1
Flush (NOP)
Q2
T
PC + 4
CY
4
Q3
Q4
DS41365C-page 31
T
CY
Internal
Phase
Clock
5
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