PIC12CE673-04/P Microchip Technology, PIC12CE673-04/P Datasheet - Page 116
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PIC12CE673-04/P
Manufacturer Part Number
PIC12CE673-04/P
Description
IC MCU OTP 1KX14 A/D&EE 8DIP
Manufacturer
Microchip Technology
Series
PIC® 12Cr
Datasheets
1.PIC16F688T-ISL.pdf
(688 pages)
2.PIC12CE673-10P.pdf
(129 pages)
3.PIC12CE673-10P.pdf
(3 pages)
4.PIC12CE673-10P.pdf
(14 pages)
5.PIC12CE673-10P.pdf
(12 pages)
Specifications of PIC12CE673-04/P
Core Size
8-Bit
Program Memory Size
1.75KB (1K x 14)
Core Processor
PIC
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
5
Program Memory Type
OTP
Eeprom Size
16 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 4x8b
Oscillator Type
Internal
Operating Temperature
0°C ~ 70°C
Package / Case
8-DIP (0.300", 7.62mm)
Controller Family/series
PIC12
No. Of I/o's
6
Eeprom Memory Size
16Byte
Ram Memory Size
128Byte
Cpu Speed
4MHz
No. Of Timers
1
Processor Series
PIC12C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
128 B
Maximum Clock Frequency
4 MHz
Number Of Programmable I/os
5
Number Of Timers
8
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
ICE2000
Minimum Operating Temperature
0 C
On-chip Adc
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
ISPICR1 - ADAPTER IN-CIRCUIT PROGRAMMINGAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Connectivity
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC12CE673-04/P
Manufacturer:
Microchip
Quantity:
486
PIC12C67X
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS30561B-page 116
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
n
eB
E1
E
Dimension Limits
2
1
Units
A2
E1
B1
eB
A1
A
E
D
B
n
p
L
c
c
D
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
A
A1
.100
.155
.130
.313
.250
.373
.130
.012
.058
.018
.370
10
10
8
B1
B
MAX
.170
.145
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MIN
6.10
9.14
3.18
0.20
1.14
0.36
7.87
3.56
2.92
0.38
7.62
5
5
MILLIMETERS
1999 Microchip Technology Inc.
NOM
2.54
3.94
3.30
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
10
8
p
A2
MAX
10.92
L
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
15
15