PIC16F883-I/SS Microchip Technology, PIC16F883-I/SS Datasheet - Page 249
![IC PIC MCU FLASH 4KX14 28SSOP](/photos/6/81/68119/150-28-ssop_sml.jpg)
PIC16F883-I/SS
Manufacturer Part Number
PIC16F883-I/SS
Description
IC PIC MCU FLASH 4KX14 28SSOP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.MCP1631RD-MCC2.pdf
(328 pages)
3.PIC16F882-ISS.pdf
(16 pages)
4.PIC16F882-ISS.pdf
(36 pages)
5.PIC16F883-ISO.pdf
(288 pages)
Specifications of PIC16F883-I/SS
Program Memory Type
FLASH
Program Memory Size
7KB (4K x 14)
Package / Case
28-SSOP
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
24
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 11x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC16F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
MSSP/EUSART
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
24
Number Of Timers
3
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM164120-3
Minimum Operating Temperature
- 40 C
On-chip Adc
11-ch x 10-bit
Package
28SSOP
Device Core
PIC
Family Name
PIC16
Maximum Speed
20 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
MCP1631RD-MCC2 - REFERENCE DESIGN MCP1631HVAC164307 - MODULE SKT FOR PM3 28SSOPXLT28SS-1 - SOCKET TRANSITION ICE 28SSOP
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F883-I/SS
Manufacturer:
ALPS
Quantity:
12 000
Company:
Part Number:
PIC16F883-I/SS
Manufacturer:
Microchip Technology
Quantity:
28 573
Company:
Part Number:
PIC16F883-I/SS
Manufacturer:
MIC
Quantity:
11
Part Number:
PIC16F883-I/SS
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
17.6
© 2007 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature
TH01
TH02
TH03
TH04
TH05
TH06
TH07
Legend: TBD = To Be Determined.
Note 1:
Param
No.
2:
3:
Thermal Considerations
θ
θ
T
PD
P
P
P
I
T
Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (P
DD
A
JA
JC
J
INTERNAL
I
DER
/
O
= Ambient Temperature.
Sym
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
-40°C ≤ T
Characteristic
A
≤ +125°C
DER
).
PIC16F882/883/884/886/887
Preliminary
TBD
TBD
47.2
24.4
45.8
60.2
80.2
89.4
24.7
14.5
23.8
23.9
Typ
150
29
29
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
W
W
W
W
C
40-pin PDIP package
44-pin QFN package
44-pin TQFP package
28-pin PDIP package
28-pin SOIC package
28-pin SSOP package
28-pin QFN package
40-pin PDIP package
44-pin QFN package
44-pin TQFP package
28-pin PDIP package
28-pin SOIC package
28-pin SSOP package
28-pin QFN package
For derated power calculations
PD = P
P
(NOTE 1)
P
P
(NOTE 2, 3)
INTERNAL
I
DER
/
O
= Σ (I
= (T
INTERNAL
OL
J
= I
- T
* V
DD
A
Conditions
)/θ
OL
+ P
x V
) + Σ (I
JA
DD
I
/
O
DS41291D-page 247
OH
* (V
DD
- V
OH
))