BGF 119 E6329 Infineon Technologies, BGF 119 E6329 Datasheet
BGF 119 E6329
Specifications of BGF 119 E6329
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BGF 119 E6329 Summary of contents
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... Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body support and/or maintain and sustain and/or protect human life ...
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BGF119 Revision History: 2008-11-18, V3.0 Previous Version: 2008-10-20, V2.0 Page Subjects (major changes since last revision) 6 Updated Figure 3 All Target status removed Data Sheet 3 BGF119 V3.0, 2008-11-18 ...
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Transient Voltage Suppressor Features • 1 channel TVS diode designed for portable application • ESD protection according to IEC61000-4-2 for +/-15 kV contact discharge on all IOs • Wafer Level Package with SnAgCu solder balls • RoHS and WEEE compliant ...
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Table 1 Maximum Ratings Parameter Voltage at all pins to GND Operating temperature range Storage temperature range Electrostatic discharge according to IEC61000- 1) 4-2 at all pins 1) Contact discharge Table 2 Electrical Characteristics Parameter Line capacitance to GND Forward ...
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Figure 2 Line capacitance versus reverse voltage (typical values) at 25°C BGF119 Peak pulse current vs clamping voltage 100,0 10,0 1,0 0,1 10 Figure 3 Peak pulse reverse current (IEC61000-4-5) versus clamping ...
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Package Outline Pin A1 2) Corner Index Area STANDOFF 0. COPLANARITY 1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum corner identified by marking 3) Primary datum C and seating ...