ESDALC6V1-5T6 STMicroelectronics, ESDALC6V1-5T6 Datasheet - Page 8

• Manufacturer Part Number: ESDALC6V1-5T6
• Description: TRANSIL ARRAY LOW CAP ESD UDFN
• Manufacturer: STMicroelectronics

Specifications of ESDALC6V1-5T6

• Voltage - Reverse Standoff (typ): 3V
• Voltage - Breakdown: 6.1V
• Power (watts): 25W
• Polarization: 5 Channel Array - Unidirectional
• Mounting Type: Surface Mount
• Package / Case: 6-µDFN
• Polarity: Unidirectional
• Channels: 5 Channels
• Operating Voltage: 3 V
• Breakdown Voltage: 6.1 V
• Termination Style: SMD/SMT
• Peak Surge Current: 2 A
• Peak Pulse Power Dissipation: 25 W
• Capacitance: 7 pF
• Dimensions: 1 mm W x 1 mm L x 0.4 mm H
• Suppressor Type: Diode Arrays
• Esd Protection Voltage: 8KV@HBM/15KV@Air Gap/8KV@Contact Disc
• Direction Type: Uni-Directional
• Configuration: Quint
• Mounting Style: Surface Mount
• Leakage Current (max): 0.1uA
• Capacitance Value: 9pF
• Operating Temperature Min Deg. C: -55C
• Operating Temperature Max Deg. C: 125C
• Product Length (mm): 1mm
• Product Depth (mm): 1mm
• Product Height (mm): 0.35mm
• Pin Count: 6
• Rad Hardened: No
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-10291-2

Recommendation on PCB assembly
4.2
4.3
4.4
8/11
Solder paste
1.
2.
3.
4.
Placement
1.
2.
3.
4.
5.
6.
PCB design preference
1.
2.
Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
“No clean” solder paste is recommended.
Offers a high tack force to resist component movement during high speed.
Solder paste with fine particles: powder particle size is 20-45 µm.
Manual positioning is not recommended.
It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering.
Standard tolerance of ± 0.05 mm is recommended.
3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
To control the solder paste amount, the closed via is recommended instead of open
vias.
The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
Doc ID 16741 Rev 2
ESDALC6V1-5T6