EVB9S08DZ60 Freescale Semiconductor, EVB9S08DZ60 Datasheet - Page 371
EVB9S08DZ60
Manufacturer Part Number
EVB9S08DZ60
Description
BOARD EVAL FOR 9S08DZ60
Manufacturer
Freescale Semiconductor
Type
MCUr
Datasheets
1.DEMO9S08DZ60.pdf
(416 pages)
2.EVB9S08DZ60.pdf
(2 pages)
3.EVB9S08DZ60.pdf
(32 pages)
4.EVB9S08DZ60.pdf
(13 pages)
5.EVB9S08DZ60.pdf
(4 pages)
Specifications of EVB9S08DZ60
Contents
Module and Misc Hardware
Processor To Be Evaluated
S08D
Data Bus Width
8 bit
Interface Type
RS-232, USB
Silicon Manufacturer
Freescale
Core Architecture
HCS08
Core Sub-architecture
HCS08
Silicon Core Number
MC9S08
Silicon Family Name
S08D
Kit Contents
Board Cables CD Power Supply
Rohs Compliant
Yes
For Use With/related Products
MC9S08DZ60
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
EVB9S08DZ60
Manufacturer:
TI
Quantity:
101
- DEMO9S08DZ60 PDF datasheet
- EVB9S08DZ60 PDF datasheet #2
- EVB9S08DZ60 PDF datasheet #3
- EVB9S08DZ60 PDF datasheet #4
- EVB9S08DZ60 PDF datasheet #5
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- Download datasheet (5Mb)
The average chip-junction temperature (T
where:
For most applications, P
(if P
Solving equations 1 and 2 for K gives:
Freescale Semiconductor
1
2
I/O
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
Junction to Ambient Natural Convection
Num
1
2
3
is neglected) is:
T
θ
P
P
P
C
D
T
D
JA
A
D
int
I/O
= Ambient temperature, °C
= P
= Package thermal resistance, junction-to-ambient, °C/W
= I
Operating temperature range (packaged)
Maximum Junction Temperature
Thermal resistance
= Power dissipation on input and output pins — user determined
int
DD
+ P
Single-layer board
Four-Layer board
× V
I/O
I/O
DD
<< P
, Watts — chip internal power
K = P
2
int
Rating
and can be neglected. An approximate relationship between P
MC9S08DZ60 Series Data Sheet, Rev. 4
Table A-3. Thermal Characteristics
D
P
T
× (T
D
J
= K ÷ (T
J
= T
A
1
) in °C can be obtained from:
64-pin LQFP
48-pin LQFP
32-pin LQFP
64-pin LQFP
48-pin LQFP
32-pin LQFP
+ 273°C) + θ
A
+ (P
J
D
+ 273°C)
× θ
JA
JA
)
Symbol
× (P
θ
θ
θ
θ
θ
θ
T
T
JA
JA
JA
JA
JA
JA
A
J
D
)
2
–40 to 125
–40 to 105
–40 to 85
Value
135
Appendix A Electrical Characteristics
69
75
80
51
51
52
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C
°C
Temp.
Code
D
Eqn. A-1
Eqn. A-2
Eqn. A-3
—
M
C
V
and T
371
J
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