PBMCUSLK Freescale Semiconductor, PBMCUSLK Datasheet - Page 13

• Manufacturer Part Number: PBMCUSLK
• Description: PROJECT BOARD FOR MCU
• Manufacturer: Freescale Semiconductor

Specifications of PBMCUSLK

• Module/board Type: Student Learning Kit
• Silicon Manufacturer: Freescale
• Core Architecture: HCS08, S12
• Core Sub-architecture: HCS08, S12
• Silicon Core Number: MC9S08, MC9S12
• Silicon Family Name: S08QG, S12D
• Rohs Compliant: Yes
• For Use With/related Products: HC(S)12(X), HC(S)08, DSP, and ColdFire modules
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

USB Speed
The communications speed over the USB bus is controlled by the J301 (USB_SPEED) header
illustrated in figure 4. When shipped from the factory, the board is configured for high-speed
operation.
communication speed may be reduced by setting this option jumper to Full. Slowing the
communications rate often resolves any problem encountered.
Figure 4: USB_SPEED Option Header
BDM Voltage
The integrated BDM is designed to interface with either 5V or 3.3V circuits. The VDD level
selected on the PBMCUSLK is fed back to the BDM to set output drive levels. The VDD level
is selected by VDD_SEL(JP3) option header. Further details on operating voltage selection
may be found in the POWER section above.
As noted above, total current drain from the integrated BDM must not exceed 500mA.
Excessive current drain will violate the USB 2.0 specification causing the USB bus to
shutdown.
Freescale Semiconductor
CAUTION: Do not allow total current drain to exceed 500mA when powered from the USB BDM.
HIGH
HIGH
If the user encounters a communication failure, or erratic behavior, USB
USB_SPEED
USB_SPEED
●
1
2
2
●
3
FULL
FULL
Configuration:
Selects USB High-speed communications
Selects USB Full-speed communications
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