LTM4604AEV#PBF Linear Technology, LTM4604AEV#PBF Datasheet - Page 15

IC UMODULE DC/DC LV 4A 66-LGA

LTM4604AEV#PBF

Manufacturer Part Number
LTM4604AEV#PBF
Description
IC UMODULE DC/DC LV 4A 66-LGA
Manufacturer
Linear Technology
Series
µModuler
Type
Point of Load (POL) Non-Isolatedr
Datasheet

Specifications of LTM4604AEV#PBF

Design Resources
LTM4604A Spice Model
Output
0.8 ~ 5 V
Number Of Outputs
1
Power (watts)
20W
Mounting Type
Surface Mount
Voltage - Input
2.38 ~ 5.5 V
Package / Case
66-LGA
1st Output
0.8 ~ 5 VDC @ 4A
Size / Dimension
0.59" L x 0.35" W x 0.09" H (15mm x 9mm x 2.3mm)
Power (watts) - Rated
20W
Operating Temperature
-40°C ~ 125°C
Efficiency
95%
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
3rd Output
-
2nd Output
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LTM4604AEV#PBF
Manufacturer:
AD
Quantity:
201
Company:
Part Number:
LTM4604AEV#PBFLTM4604AEV#TRPBF/AIV
Manufacturer:
LT
Quantity:
13
Safety Considerations
The LTM4604A modules do not provide isolation from
V
blow fuse with a rating twice the maximum input current
needs to be provided to protect each unit from catastrophic
failure.
Layout Checklist/Example
The high integration of LTM4604A makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout consid-
erations are still necessary.
APPLICATIONS INFORMATION
• Use large PCB copper areas for high current path,
IN
V
including V
PCB conduction loss and thermal stress.
IN
to V
OUT
C
. There is no internal fuse. If required, a slow
IN
Figure 14. Recommended PCB Layout
IN
, GND and V
GND
OUT
. It helps to minimize the
V
OUT
C
C
C
OUT
OUT
OUT
GND
4604A F14
Figure 14 gives a good example of the recommended
layout.
• Place high frequency ceramic input and output capaci-
• Place a dedicated power ground layer underneath the
• To minimize the via conduction loss and reduce module
• Do not put vias directly on the pads unless they are
• SW pads can be soldered to board to improve thermal
tors next to the V
high frequency noise.
unit.
thermal stress, use multiple vias for interconnection
between top layer and other power layers.
capped.
performance.
Figure 15. Typical 2.375V to 5.5V Input, 1.5V at 4A Design
OPEN-DRAIN
C
0.01μF
SSEXT
PULL UP
X5R OR X7R
10μF
6.3V
C
IN
PGOOD
COMP
RUN/SS
2.375V TO 5.5V
IN
LTM4604A
, GND and V
GND
V
V
IN
IN
TRACK
V
OUT
FB
OUT
R
5.69k
LTM4604A
FB
pins to minimize
4604A F15
C
22μF ×3
6.3V
X5R OR X7R
OUT
V
1.5V
4A
OUT
15
4604af

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