MT18HTF12872FDY-667D5E3 Micron Technology Inc, MT18HTF12872FDY-667D5E3 Datasheet
MT18HTF12872FDY-667D5E3
Specifications of MT18HTF12872FDY-667D5E3
Related parts for MT18HTF12872FDY-667D5E3
MT18HTF12872FDY-667D5E3 Summary of contents
Page 1
DDR2 SDRAM FBDIMM MT18HTF12872FD – 1GB MT18HTF25672FD – 2GB Features • 240-pin, DDR2 fully buffered dual in-line memory module (FBDIMM) • Fast data transfer rates: PC2-4200, PC2-5300, or PC2-6400 • 1GB (128 Meg x 72), 2GB (256 Meg x 72) ...
Page 2
... Table 3: Part Numbers and Timing Parameters – 1GB 1 Base device: MT47H64M8, 512Mb DDR2 SDRAM Module 2 Part Number Density MT18HTF12872FDY-80E__ 1GB MT18HTF12872FDY-667__ 1GB MT18HTF12872FDY-53E__ 1GB Table 4: Part Numbers and Timing Parameters – 2GB 1 Base device: MT47H128M8, 1Gb DDR2 SDRAM Module 2 Part Number Density MT18HTF25672FDY-80E__ 2GB ...
Page 3
Pin Assignments and Descriptions Table 5: Pin Assignments 240-Pin FBDIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol PN3 PN3 ...
Page 4
Table 6: Pin Descriptions Symbol Type Description PS[9:0] Input Primary southbound data, positive lines. PS#[9:0] Input Primary southbound data, negative lines. SCK Input System clock input, positive line. SCK# Input System clock Input, negative line. SCL Input Serial presence-detect (SPD) ...
Page 5
... System Block Diagram Commodity DDR2 DDR2 SDRAM component devices DDR2 component DDR2 component DDR2 component modules AMB • • • DDR2 component DDR2 component DDR2 component DDR2 component SMBus access to buffer registers Micron Technology, Inc. reserves the right to change products or specifications without notice. ...
Page 6
Functional Block Diagram Figure 3: Functional Block Diagram CS1# CS0# DQS0 DQS0# DM0 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQS1 DQS1# DM5 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DQS2 DQS2# DM2 DQ16 DQ17 DQ18 DQ19 DQ20 ...
Page 7
General Description Micron’s FBDIMM devices adhere to the currently proposed industry specifications for FBDIMMs. The following specifications contain detailed information on FBDIMM de- sign, interfaces, and theory of operation and are listed here for the system designers’ convenience. Refer to ...
Page 8
Table 7: I Conditions (Continued) DD Symbol Condition I Training: Primary and secondary channels enabled; 100% toggle on all channel lanes; DD_TRAINING DRAMs idle; 0% bandwidth; CKE HIGH; Command and address lines stable; DDR2 SDRAM clock active I IBIST over ...
Page 9
Table 12: I Specifications – 2GB DDR2-667 DD Symbol I DD_IDLE_0 I 2600 CC I 1420 DD Total power 6.8 Table 13: I Specifications – 12B DDR2-800 DD Symbol I DD_IDLE_0 I TBD CC I TBD DD Total power TBD ...
Page 10
Table 15: Serial Presence-Detect EEPROM AC Operating Conditions (Continued) Parameter/Condition SDA and SCL rise time SCL clock frequency Data-in setup time Start condition setup time Stop condition setup time WRITE cycle time 1. To avoid spurious start and stop conditions, ...
Page 11
Module Dimensions Figure 4: 240-Pin DDR2 FBDIMM 66.68 (2.63) TYP 0.5 (0.02) R (4X) 1.5 (0.059 (4X) 2.6 (0.102) D (2X) 5.2 (0.205) TYP 1.25 (0.0492) Pin 1 TYP 1.0 (0.039) TYP 74.68 (2.94) 9.9 (0.39) TYP ...
Page 12
S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900 www.micron.com/productsupport Customer Comment Line: 800-932-4992 Micron and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners. This data ...