PCA9521D,118 NXP Semiconductors, PCA9521D,118 Datasheet
PCA9521D,118
Specifications of PCA9521D,118
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PCA9521D,118 Summary of contents
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PCA9521 Fast dual bidirectional bus buffer Rev. 2 — 19 March 2013 1. General description The PCA9521 is a monolithic bipolar integrated circuit for bus buffering in applications including I The buffer extends the bus load limit by buffering both ...
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... PCA9521D PCA9521 PCA9521DP 9521 4.1 Ordering options Table 2. Ordering options Type number Orderable part number PCA9521D PCA9521D,118 PCA9521DP PCA9521DP,118 PCA9521 Product data sheet Package Name Description SO8 plastic small outline package; 8 leads; body width 3.9 mm TSSOP8 plastic thin shrink small outline package; 8 leads; ...
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... NXP Semiconductors 5. Block diagram Fig 1. 6. Pinning information 6.1 Pinning Fig 2. 6.2 Pin description Table 3. Symbol EN SA1 SA2 GND n.c. SB2 SB1 V CC [1] Recommended I PCA9521 Product data sheet 1 1 enable EN ( SA1 SCL SB1 SDA Block diagram ...
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... NXP Semiconductors 7. Functional description Refer to 7 GND — supply pins CC The power supply voltage for the PCA9521 may be any voltage in the range 2 5.5 V. The threshold level below which the output will begin to match the input Hence, the operating voltage should be chosen with the required bus voltage, CC switching threshold, and noise margins, in mind ...
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... NXP Semiconductors 8. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol I(EN tot T stg T amb [1] Voltages are specified with respect to pin 4 (GND). 9. Characteristics Table 5. Characteristics +85 C; voltages are specified with respect to ground (GND). ...
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... NXP Semiconductors Table 5. Characteristics …continued +85 C; voltages are specified with respect to ground (GND). amb Symbol Parameter [1] Timing characteristics t delay time d t fall time operating frequency oper(I2C) t enable to active delay time d(en-act) t disable to standby delay time EN LOW to Sxx disabled ...
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... NXP Semiconductors 4.5 voltage (V) 3.5 2.5 1.5 0.5 −0.5 horizontal scale = 40 ns/div (1) Input 33 pF (2) Output 120 pF Fig 8. Rise time (4 mA pull-up) PCA9521 Product data sheet 002aaf285 4.5 voltage (V) 3.5 (2) 2.5 (1) 1.5 0.5 −0.5 horizontal scale = 40 ns/div time (ns) (1) Input 33 pF (2) Output 120 pF Fig 9. Fall time (4 mA pull-up) All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 10. Application information 10.1 Design considerations Figure 10 speed. The PCA9521 has excellent application to extending loads and providing interfaces to connectors on high-speed microprocessor cards, well in excess of the Fast-mode 400 kHz I the buffer with the slowest RC time constant. (1) Input 33 pF (2) Output 120 pF Fig 10. 1 3.3 V level shifting at 1 MHz Figure 11 different bus voltages without the need for external components ...
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... NXP Semiconductors 1 600 Ω SCL SDA BUS MASTER 400 kHz U1 Fig 11. PCA9521 typical buffer application Figure 12 Shelf Management Controller board (ShMC). The PCA9521 is highly suited to this and other backplane applications, providing excellent noise margins and I switching levels. fully bused compliant plug-in (hot-insert) ShMC module (e ...
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... NXP Semiconductors Peripheral cards (or FRU (Field Replaceable Units)) and backplanes operating at a range of voltages can be interfaced together using a minimum of components. The PCA9521 can be teamed with the PCA9522 to achieve substantial noise margin gains across a system. Multiplexers such as the PCA9544A are simple analog switches which provide no capacitive load isolation between connected branches ...
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... NXP Semiconductors BUS MASTER U1 Fig 14. PCA9521 multiplexer isolation application demultiplexer Fig 15. PCA9521 bus multiplexer application driven from a simple logic device PCA9521 Product data sheet 1.5 kΩ 1.5 kΩ 1.1 kΩ SCL SA1 SA2 SDA SB1 SB2 PCA9521 EN U2 Alternately, using the PCA9546A (which allows multiple outputs to be selected) you would simply ...
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... NXP Semiconductors SCL SDA Fig 16. PCA9521 bus multiplexer application driven from an I 10.2 Input to output offset voltage calculation The offset voltage between the side acting as the output (Sxx(out)) and the side acting as the input (Sxx(in)) of the PCA9521 can be calculated using the relationship given in ...
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... NXP Semiconductors 11. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors TSSOP8: plastic thin shrink small outline package; 8 leads; body width pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors 12. Handling information CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “ ...
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... NXP Semiconductors 13.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 13 ...
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... NXP Semiconductors Fig 19. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 14. Soldering: PCB footprints Fig 20. PCB footprint for SOT96-1 (SO8); reflow soldering PCA9521 Product data sheet maximum peak temperature ...
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... NXP Semiconductors Fig 21. PCB footprint for SOT96-1 (SO8); wave soldering Fig 22. PCB footprint for SOT505-1 (TSSOP8); reflow soldering PCA9521 Product data sheet 1.20 (2×) 0.60 (6×) 0.3 (2×) 1.27 (6×) 5.50 board direction solder lands solder resist placement accurracy ± 0.25 occupied area 0.725 5.750 3.600 1.150 ...
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... NXP Semiconductors 15. Abbreviations Table 8. Acronym ATCA CDM cPCI ESD HBM 2 I C-bus IC IPMB PICMG PMBus RAID SMBus PCA9521 Product data sheet Abbreviations Description Advanced Telecommunications Computing Architecture Charged-Device Model compact Peripheral Component Interconnect ElectroStatic Discharge Human Body Model Inter-Integrated Circuit bus ...
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... NXP Semiconductors 16. Revision history Table 9. Revision history Document ID Release date PCA9521 v.2 20130319 • Modifications: Added • Table 5 – – – • Table 5 – V Sxx Typ value changed from “12 A” to “6 A” – Max value changed from “ ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... For sales office addresses, please send an email to: PCA9521 Product data sheet own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 4 7 GND — supply pins . . . . . . . . . . . . . . . . . 4 CC 7.2 SA1, SA2, SB1, SB2 — buffer inputs/outputs . 4 7.3 EN — ...