C8051F964-A-GQ Silicon Labs, C8051F964-A-GQ Datasheet - Page 48

• Manufacturer Part Number: C8051F964-A-GQ
• Description: 8-bit Microcontrollers - MCU 64KB DC-DC LCD AES
• Manufacturer: Silicon Labs

Specifications of C8051F964-A-GQ

• Rohs: yes
• Core: 8051
• Processor Series: C8051
• Data Bus Width: 8 bit
• Maximum Clock Frequency: 24.5 MHz
• Program Memory Size: 64 KB
• Data Ram Size: 8 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 1.8 V to 3.8 V
• Operating Temperature Range: - 40 C to + 85 C
• Package / Case: QFP-80
• Mounting Style: SMD/SMT

C8051F96x
3.1.3. Soldering Guidelines
3.1.3.1. Solder Mask Design
All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the
metal pad is to be 60 m minimum, all the way around the pad.
3.1.3.2. Stencil Design
3.1.3.3. Card Assembly
3.1.3.4. Inner via placement
48
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
4. A 2x2 array of 1.25 mm square openings on 1.60 mm pitch should be used for the center ground
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
1. Inner via placement per Figure 3.6.
2. Reccomended via hole size is 0.150 mm (6 mil) laser drilled holes.
assure good solder paste release.
pad.
Components.
Rev. 0.5