TH50VSF3582AASB TOSHIBA [Toshiba Semiconductor], TH50VSF3582AASB Datasheet

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TH50VSF3582AASB

Manufacturer Part Number
TH50VSF3582AASB
Description
TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS
Manufacturer
TOSHIBA [Toshiba Semiconductor]
Datasheet
TENTATIVE
SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
DESCRIPTION
33,554,432-bit flash memory. The CIOS and CIOF inputs can be used to select the optimal memory configuration.
The power supply. FLASH MEMORY a Simultaneous Read/Write operation so that data can be read during a Write
or Erase operation. The TH50VSF3582/3583AASB can range from 2.67 V to 3.3 V. The TH50VSF3582/3583AASB is
available in a 69-pin BGA package, making it suitable for a variety of design applications.
FEATURES
PIN ASSIGNMENT
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general
• The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal
The TH50VSF3582/3583AASB is a mixed multi-chip package containing a 8,388,608-bit Full CMOS SRAM and a
can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the
buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and
to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or
damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the
most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling
Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..
equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are
neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or
failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy
control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control
instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document
shall be made at the customer’s own risk.
C
D
G
H
M
Power supply voltage
Data retention supply voltage
Current consumption
Block erase architecture for flash memory
Organization
Case: CIOF = V
A
B
E
F
K
J
L
CIOF
V
V
V
CC
CC
SS
V
V
V
Operating: 45 mA maximum (CMOS level)
Standby:
Standby:
8 × 8 Kbytes
63 × 64 Kbytes
CCs
CCf
CCs
NC
NC
NC
NC
NC
NC
NC
1
CIOS
V
V
V
= 2.67 V~3.3 V
= 2.67 V~3.3 V
= 1.5 V~3.3 V
CC
SS
SS
CE
CEF
A3
A2
A1
A0
2
1
S
2,097,152 words of 16 bits
2,097,152 words of 16 bits
4,194,304 words of 8 bits
CC
10 µA maximum (SRAM CMOS level)
10 µA maximum (FLASH)
TOSHIBA MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS
DQ0
DQ8
V
OE
, CIOS = V
A7
A6
A5
A4
3
SS
Flash Memory
DQ10
DQ1
DQ9
DQ2
A18
A17
UB
LB
(TOP VIEW)
4
CC
WP
RESET
RY
DQ11
V
DQ3
(×16, ×16)
CCf
/ACC
5
/
BY
CE2S
V
CIOS
DQ4
WE
A20
524,288 words of 16 bits
1,048,576 words of 8 bits
1,048,576 words of 8 bits
CCs
6
DQ13 DQ15 CIOF
DQ12
DQ6
DQ5
A19
A10
A8
A9
7
SRAM
DQ14
DQ7
A12
A13
A14
A11
DU
8
V
A15
A16
NC
NC
9
SS
NC
NC
NC
NC
NC
NC
10
Function mode control for flash memory
Flash memory functions
Erase and Program cycle for flash memory
Boot block architecture for flash memory
Package
PIN NAMES
Compatible with JEDEC-standard commands
Simultaneous Read/Write operations
Auto-Program
Auto Chip Erase, Auto Block Erase
Auto Multiple-Block Erase
Program Suspend/Resume
Block-Erase Suspend/Resume
Data Polling/Toggle Bit function
Block Protection/Boot Block Protection
Automatic Sleep, Hidden ROM Area Supports
Common Flash Memory Interface (CFI)
Byte/Word Mode
10
TH50VSF3582AASB: Top boot block
TH50VSF3583AASB: Bottom boot block
P-FBGA69-1209-0.80A3: 0.31 g (typ.)
CE
DQ0~DQ15
5
LB , UB
WP
A0~A21
RESET
RY
1
cycles (typical)
A12S
CIOS
V
A12F
S
CIOF
V
CEF
V
WE
OE
NC
DU
SA
CCs
CCf
/ACC
SS
/
, CE2S Chip Enable Inputs for SRAM
BY
TH50VSF3582/3583AASB
A18 Input for SRAM
Data Inputs/Outputs
Chip Enable Input for Flash Memory
Output Enable Input
Write Enable Input
Data Byte Control Input
Ready/Busy Output
Hardware Reset Input
Write Protect/Program Acceleration Input
Word Enable Input for SRAM
Word Enable Input for Flash Memory
Power Supply for SRAM
Power Supply for Flash Memory
Ground
Not Connected
Don’t Use
Address Inputs
A12 Input for SRAM
A12 Input for Flash Memory
2001-06-08 1/50
000707EBA2

Related parts for TH50VSF3582AASB

TH50VSF3582AASB Summary of contents

Page 1

... Erase and Program cycle for flash memory 5 10 SRAM • Boot block architecture for flash memory 524,288 words of 16 bits TH50VSF3582AASB: Top boot block 1,048,576 words of 8 bits TH50VSF3583AASB: Bottom boot block 1,048,576 words of 8 bits • Package P-FBGA69-1209-0.80A3: 0.31 g (typ.) ...

Page 2

PIN ASSIGNMENT (TOP VIEW) • Case: CIOF = V , CIOS = V (×16, × /ACC RESET ...

Page 3

BLOCK DIAGRAM A0~A21 WP /ACC RESET CEF CIOF CE2S UB LB CIOS MODE SELECTION OPERATION MODE CEF L Flash Read L H SRAM Read Flash Write L H ...

Page 4

... ID CODE TABLE TYPE Manufacturer Code TH50VSF3582AASB Device Code TH50VSF3583AASB Verify Block Protect Note (1) DQ8~DQ15 are Hi-Z in Byte mode (2) BA: Block address (3) 0001H: Protected block 0000H: Unprotected block A20~A12 ( TH50VSF3582/3583AASB A0 CODE (HEX 0098H ...

Page 5

... IA: Bank Address and ID Read Address (A6, A1, A0) Bank Address = A20~A15 Manufacturer Code = ( Device Code = ( (5) ID: ID Data 0098H - Manufacturer Code 009AH - Device Code (TH50VSF3582AASB) 009CH - Device Code (TH50VSF3583AASB) 0001H - Protected Block SECOND BUS THIRD BUS WRITE CYCLE WRITE CYCLE Data Addr ...

Page 6

... BLOCK ERASE ADDRESS TABLES TH50VSF3582AASB (top boot block) BANK BLOCK # # A20 A19 A18 A17 A16 A15 A14 A13 A12 BA0 L BA1 L BA2 L BA3 L BK0 BA4 L BA5 L BA6 L BA7 L BA8 L BA9 L BA10 L BA11 L BK1 BA12 L BA13 L BA14 L BA15 L BA16 L BA17 L BA18 L BA19 ...

Page 7

BANK BLOCK BANK ADDRESS # # A20 A19 A18 A17 A16 A15 A14 A13 A12 BA32 H L BA33 H L BA34 H L BA35 H L BK4 BA36 H L BA37 H L BA38 H L BA39 H L ...

Page 8

BANK BLOCK BANK ADDRESS # # A20 A19 A18 A17 A16 A15 A14 A13 A12 BA63 H H BA64 H H BA65 H H BA66 H H BK8 BA67 H H BA68 H H BA69 H H BA70 H H ...

Page 9

TH50VSF3583AASB (bottom boot block) BANK BLOCK BANK ADDRESS # # A20 A19 A18 A17 A16 A15 A14 A13 A12 BA0 L L BA1 L L BA2 L L BA3 L L BK0 BA4 L L BA5 L L BA6 L ...

Page 10

BANK BLOCK BANK ADDRESS # # A20 A19 A18 A17 A16 A15 A14 A13 A12 BA31 L H BA32 L H BA33 L H BA34 L H BK4 BA35 L H BA36 L H BA37 L H BA38 L H ...

Page 11

BANK BLOCK BANK ADDRESS # # A20 A19 A18 A17 A16 A15 A14 A13 A12 BA63 H H BA64 H H BA65 H H BA66 H H BK8 BA67 H H BA68 H H BA69 H H BA70 H H ...

Page 12

... BLOCK SIZE TABLE TH50VSF3582AASB (top boot block) BLOCK SIZE BLOCK # BYTE MODE BA0~BA7 64 Kbytes BA8~BA15 64 Kbytes BA16~BA23 64 Kbytes BA24~BA31 64 Kbytes BA32~BA39 64 Kbytes BA40~BA47 64 Kbytes BA48~BA55 64 Kbytes BA56~BA62 64 Kbytes BA63~BA70 8 Kbytes TH50VSF3583AASB (bottom boot block) BLOCK SIZE BLOCK # BYTE MODE BA0~BA7 8 Kbytes ...

Page 13

ABSOLUTE MAXIMUM RATINGS SYMBOL Supply Voltage CC CCs CCf (1) V Input Voltage IN V Input/Output Voltage DQ T Operating Temperature opr P Power Dissipation D T Soldering Temperature (10 s) solder I Output Short Circuit Current ...

Page 14

RECOMMENDED DC OPERATING CONDITIONS SYMBOL V /V Power Supply Voltage CCs CCf V Input High-Level Voltage IH V Input Low-Level Voltage IL V Data Retention Voltage for SRAM DH V Flash Low-Lock Voltage LKO V High Voltage for WP ACC ...

Page 15

V DC CHARACTERISTICS SYMBOL PARAMETER I Input Leakage Current IL Input Leakage Current I ILW ( WP /ACC pin) I SRAM Output High Current SOH I SRAM Output Low Current SOL I Flash Output ...

Page 16

V AC CHARACTERISTICS Read cycle SYMBOL t Read Cycle Time RC t Address Access Time ACC t Chip Enable ( CO1 t Chip Enable (CE2S) Access Time CO2 t Output ...

Page 17

AC CHARACTERISTICS (FLASH MEMORY) READ CYCLE SYMBOL PARAMETER t Read Cycle Time RC t Address Access Time ACC t CEF Access Time Access Time OE t CEF to Output Low-Z CEE Output Low-Z OEE ...

Page 18

COMMAND WRITE/PROGRAM/ERASE CYCLE SYMBOL PARAMETER t Command Write Cycle Time CMD t Address Set-up Time / BYTE Set-up Time AS t Address Hold Time / BYTE Hold Time AH t Address Hold Time from WE High level AHW t Data ...

Page 19

SIMULTANEOUS READ/WRITE OPERATION The TH50VSF3582/3583AASB features a Simultaneous Read/Write operation. The Simultaneous Read/Write operation enables the device to simultaneously write data to or erase data from a bank while the device reads data from another bank. The TH50VSF3582/3583AASB has a ...

Page 20

ID Read Mode ID Read mode is used to read the device maker code and device code. The mode is useful for EPROM programmers to automatically identify the device type. In this method, simultaneous operation can be performed. Inputting an ...

Page 21

Command Write The TH50VSF3582/3583AASB utilizes the JEDEC command control standard for a single power supply 2 E PROM. A Command is executed by inputting an address and data into the Command register. The Command is written by inputting a pulse ...

Page 22

Auto-Program Mode The TH50VSF3582/3583AASB can be programmed in either byte or word units. The Auto Program mode is set using the Program command. The program address is latched on the falling edge of the WE signal and data is latched ...

Page 23

Program Suspend / Resume Mode Program Suspend is used to enable Data Read by suspending Write operation. The device receives a Program Suspend command in Write mode (including Write performed during Erase Suspend) but ignores the command in other modes. ...

Page 24

Auto Block / Multiple Block Erase Mode The Auto Block and Multiple Block Erase modes are set using the Block Erase command. The block address is latched on the falling edge of the WE signal in the sixth bus cycle. ...

Page 25

Block Protect Block Protection is a function to disable write and erase in block units. Applying V to RESET and inputting the Block Protect command performs block protection. The first cycle of ID the command sequence is the Setup command. ...

Page 26

... To exit Hidden ROM mode, use the Hidden ROM Mode Exit command. The device returns to Read mode. Hidden Rom Area Address Table BOOT BLOCK TYPE ARCHITECTURE TH50VSF3582AASB TOP BOOT BLOCK TH50VSF3583AASB BOTTOM BOOT BLOCK rather than V is input to RESET . Once the block is protected, ...

Page 27

Common Flash Memory Interface (CFI) The TH50VSF3582/3583AASB conforms to the CFI. Information on device specifications and characteristics can be obtained via CFI. To read information from the device, input the Query command followed by the address. In Word mode, DQ8 ...

Page 28

... Block Protect/Unprotect scheme Simultaneous Operation 0: Not Supported 1: Supported Burst Mode 0: Not Supported Page Mode 0: Not Supported V Min voltage ACC DQ7~DQ4 DQ3~DQ0: 100 mV V Max voltage ACC DQ7~DQ4 DQ3~DQ0: 100 mV Top/Bottom Boot Block Flag 2: TH50VSF3582AASB 3: TH50VSF3583AASB Program Suspend 0: Not Supported 1: Supported 2001-06-08 28/50 ...

Page 29

HARDWARE SEQUENCE FLAGS FOR FLASH MEMORY The TH50VSF3582/3583AASB has a Hardware Sequence flag which allows the device status to be determined during an auto mode operation. The output data is read out using the same timing as that used when ...

Page 30

DQ3 (Block Erase timer) The Block Erase operation starts 50 µs (Erase Hold Time) after the rising edge the last command cycle. DQ3 outputs a 0 during the Block Erase Hold Time and a 1 when the ...

Page 31

DATA PROTECTION The TH50VSF3582/3583AASB features a function which makes malfunction or data damage difficult. Protection Against Program/Erase Caused by Low Supply Voltage To prevent malfunction at power on or power down, the device does not receive commands when V V ...

Page 32

TIMING DIAGRAMS FLASH READ/ID READ OPERATION Address CEF OEH D OUT SRAM READ CYCLE (see Note 1) Address CE2S Hi-Z OUT Data Invalid t ...

Page 33

SRAM WRITE CYCLE Address CE2S See Note 2 OUT D See Note SRAM WRITE CYCLE 2 ( Address CE2S CE ...

Page 34

SRAM WRITE CYCLE 3 (CE2S-CONTROLLED) (see Note 4) Address CE2S OUT D See Note SRAM WRITE CYCLE 4 ( Address CE2S UB ...

Page 35

FLASH COMMAND WRITE OPERATION This is the timing of the Command Write Operation. The timing which described follow pages is typically same as this page’s. • WE Control Address CEF CEF Control • Address CEF WE D ...

Page 36

FLASH ID READ OPERATION (Input command sequence) Address 555H t CMD CEF OE t OES WE D AAH IN D OUT Read Mode (Input ID Read Command Sequence) (Continued) 555H Address t CMD CEF AAH IN D ...

Page 37

FLASH AUTO-PROGRAM OPERATION ( Address 555H t CMD CEF OE t OES WE D AAH IN D OUT t VCS V CCf Note: Word Mode address shown. PA: Program address PD: Program data FLASH AUTO CHIP ERASE/AUTO BLOCK ERASE OPERATION ...

Page 38

FLASH AUTO-PROGRAM OPERATION ( 555H Address t CMD CEF OE t OES AAH D OUT t VCS V CCf Notes: Word mode address shown PA: Program address PD: Program data FLASH AUTO CHIP ERASE/AUTO BLOCK ERASE OPERATION ...

Page 39

FLASH PROGRAM/ERASE SUSPEND OPERATION Address BK CEF B0H IN D Hi-Z OUT Program/Erase Mode RA: Read address BK: Bank address FLASH PROGRAM/ERASE RESUME OPERATION RA Address CEF OE t OES WE t DF1 t ...

Page 40

FLASH DURING AUTO-PROGRAM/ERASE OPERATION CEF FLASH HARDWARE RESET OPERATION WE RESET FLASH READ AFTER RESET Address RESET D OUT Command input sequence READY t RC ...

Page 41

FLASH HARDWARE SEQUENCE FLAG ( Last Address Command Address t CMD Last D Command IN Data DQ7 DQ0~DQ6 t BUSY PA: Program address BA: Block address FLASH HARDWARE SEQUENCE FLAG (Toggle Bit) Last Address ...

Page 42

FLASH BLOCK PROTECT OPERATION Address t CMD CEF VPS RESET D 60h IN D OUT Notes Block address Next Block address * : 01h ...

Page 43

TIMING FOR SWITCHING BETWEEN FLASH AND SRAM MODES CEF CE2S Notes: (1) WE remains High during a Read cycle. ( goes Low (or CE2S goes High) at the same time as or after ...

Page 44

SRAM DATA RETENTION CHARACTERISTICS SYMBOL V Data Retention Supply Voltage for SRAM DH I SRAM Standby Current CCS4 t Chip-Deselect-to-Data-Retention-Mode Time CDR t Recovery Time r (1) Read cycle time -CONTROLLED DATA RETENTION MODE (see Note 1) ...

Page 45

FLOWCHARTS OF FLASH MEMORY OPERATIONS Auto-Program Address = Address + 1 Note: Word mode command sequence is shown. Start Auto-Program Command Sequence (see below) DATA Polling or Toggle Bit No Last Address? Yes Auto-Program Completed Auto-Program command sequence (address/data) 555H/AAH ...

Page 46

Fast Program Address = Address + 1 Fast Program Set command sequence (address/data) 555H/AAH 2AAH/55H 555H/20H TH50VSF3582/3583AASB Start Fast Program Set Command Sequence (see below) Fast Program Command Sequence (see below) DATA Polling or Toggle Bit No Last Address? Yes ...

Page 47

Auto-Erase Auto Chip Erase command sequence (address/data) 555H/AAH 2AAH/55H 555H/80H 555H/AAH 2AAH/55H 555H/10H Note: Word mode command sequence is shown. Start Auto-Erase Command Sequence (see below) DATA Polling or Toggle Bit Auto-Erase Completed Auto Block Erase / Multiple-Block Erase command ...

Page 48

DQ7 ( DATA Polling) Start Read Byte (DQ0~DQ7) Addr DQ7 = Data? No DQ5 = 1? Read Byte (DQ0~DQ7) Addr DQ7 = Data? Fail DQ6 (Toggle bit) Start Read Byte (DQ0~DQ7) Addr DQ6 = ...

Page 49

Block Protect RESET = V PLSCNT = 1 Block Protect Command First Bus Write Cycle Set up Address Addr. = BPA Block Protect Command Second Bus Write Cycle Wait to 100 µs Block Protect Command Third Bus Write Cycle Verify ...

Page 50

PACKAGE DIMENSIONS TH50VSF3582/3583AASB Unit: mm 2001-06-08 50/50 ...

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