M27V512-200N6TR STMicroelectronics, M27V512-200N6TR Datasheet - Page 5

• Manufacturer Part Number: M27V512-200N6TR
• Description: 512 Kbit 64Kb x8 Low Voltage UV EPROM and OTP EPROM
• Manufacturer: STMicroelectronics

Table 7. Read Mode DC Characteristics
(T
Note: 1. V
For the most efficient use of these two control
lines, E should be decoded and used as the prima-
ry device selecting function, while G should be
made a common connection to all devices in the
array and connected to the READ line from the
system control bus. This ensures that all deselect-
ed memory devices are in their low power standby
mode and that the output pins are only active
when data is required from a particular memory
device.
System Considerations
The power switching characteristics of Advanced
CMOS EPROMs require carefull decoupling of the
supplies to the devices. The supply current ICC
has three segments of importance to the system
designer: the standby current, the active current
and the transient peaks that are produced by the
falling and rising edges of E.
Symbol
A
V
I
I
V
V
I
I
CC1
CC2
I
V
IH
= 0 to 70 C; V
I
CC
LO
PP
OL
OH
LI
2. Maximum DC voltage on Output is V
IL
(2)
CC
must be applied simultaneously with or before V
Input Leakage Current
Output Leakage Current
Supply Current
Supply Current (Standby) TTL
Supply Current (Standby) CMOS
Program Current
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage TTL
CC
= 3.3V
Parameter
10%; V
CC
+0.5V.
PP
= V
(1)
CC
E = V
E = V
E > V
PP
)
and removed simultaneously or after V
f = 8MHz, V
f = 5MHz, V
IL
IL
0V
CC
Test Condition
0V
, G = V
, G = V
I
OH
I
OL
V
– 0.2V, V
The magnitude of the transient current peaks is
dependant on the capacititive and inductive load-
ing of the device outputs. The associated transient
voltage peaks can be supressed by complying
with the two line output control and by properly se-
lected decoupling capacitors. It is recommended
that a 0.1 F ceramic capacitor is used on every
device between V
high frequency type of low inherent inductance
and should be placed as close as possible to the
device. In addition, a 4.7 F electrolytic capacitor
should be used between V
eight devices. This capacitor should be mounted
near the power supply connection point. The pur-
pose of this capacitor is to overcome the voltage
drop caused by the inductive effects of PCB trac-
es.
PP
E = V
V
= –400 A
V
= 2.1mA
OUT
IN
= V
IL
IL
, I
CC
, I
CC
IH
CC
OUT
OUT
V
CC
V
CC
CC
3.6V
3.6V
= 0mA,
= 0mA,
3.6V
CC
and V
PP
–0.3
Min
2.4
2
.
CC
SS
. This should be a
and V
V
CC
Max
0.8
0.4
30
20
20
10
10
1
1
+ 1
SS
M27V800
for every
Unit
mA
mA
mA
V
V
V
V
A
A
A
A
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