MCP98243-BE/MNY MICROCHIP [Microchip Technology], MCP98243-BE/MNY Datasheet - Page 11

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MCP98243-BE/MNY

Manufacturer Part Number
MCP98243-BE/MNY
Description
Memory Module Temperature Sensor w/ EEPROM for SPD
Manufacturer
MICROCHIP [Microchip Technology]
Datasheet
3.0
The descriptions of the pins are listed in
TABLE 3-1:
3.1
These pins are device address input pins.
The address pins correspond to the Least Significant
bits (LSb) of address bits. The Most Significant bits
(MSb) (A6, A5, A4, A3). This is shown in
TABLE 3-2:
The A0 Address pin is a multi-function pin. This input
pin is also used for high voltge input V
EEPROM
Section 5.3.3 “Write Protection”.
All address pin have an internal pull-down resistors.
3.2
The GND pin is the system ground pin.
3.3
SDA is a bidirectional input/output pin, used to serially
transmit data to/from the host controller. This pin
requires a pull-up resistor. (See Section 4.0 “Serial
Communication”).
© 2009 Microchip Technology Inc.
Sensor
EEPROM
EEPROM
Write Protect
DFN, TDFN,
Note:
UDFN
Device
1
2
3
4
5
6
7
8
9
PIN DESCRIPTION
Address Pins (A0, A1, A2)
Ground Pin (GND)
Serial Data Line (SDA)
MCP98243
User-selectable address is shown by X.
Software
PIN FUNCTION TABLES
MCP98243 ADDRESS BYTE
A6
0
1
0
TSSOP
Address Code
1
2
3
4
5
6
7
8
Write
A5
0
0
1
A4
1
1
1
Protect
A3
1
0
0
Symbol
Event
GND
HV
SDA
SCL
V
EP
A0
A1
A2
A2
DD
X
Table
feature,
Table
to enable the
Address
Slave
A1
X
3-1.
3-2.
A0
see
X
Slave Address and EEPROM Software Write Protect high voltage
input (V
Slave Address
Slave Address
Ground
Serial Data Line
Serial Clock Line
Temperature Alert Output
Power Pin
Exposed Thermal Pad (EP); must be connected to GND.
HV
)
3.4
The SCL is a clock input pin. All communication and
timing is relative to the signal on this pin. The clock is
generated by the host or master controller on the bus.
(See Section 4.0 “Serial Communication”).
3.5
The MCP98243 temperature Event output pin is an
open-drain output. The device outputs a signal when
the ambient temperature goes beyond the user-pro-
grammed temperature limit. (see Section 5.2.3 “Event
Output Configuration”).
3.6
V
specified in the DC electrical specification table, is
applied on this pin.
3.7
There is an internal electrical connection between the
Exposed Thermal Pad (EP) and the GND pin; they can
be connected to the same potential on the Printed Cir-
cuit Board (PCB). This provides better thermal conduc-
tion from the PCB to the die.
DD
is the power pin. The operating voltage range, as
Serial Clock Line (SCL)
Temperature Alert, Open-Drain
Output (Event)
Power Pin (V
Exposed Thermal Pad (EP)
Description
DD
MCP98243
)
DS22153B-page 11

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