CY7C1470V25-250AXC CYPRESS [Cypress Semiconductor], CY7C1470V25-250AXC Datasheet - Page 27

• Manufacturer Part Number: CY7C1470V25-250AXC
• Manufacturer: CYPRESS [Cypress Semiconductor]

Document #: 38-05290 Rev. *E
Document History Page
Document Title: CY7C1470V25/CY7C1472V25/CY7C1474V25 72-Mbit(2M x 36/4M x 18/1M x 72) Pipelined SRAM with
NoBL™ Architecture
Document Number: 38-05290
REV.
*A
*B
*C
*D
*E
**
ECN No.
114677
121519
223721
235012
243572
299511
Issue Date
See ECN
See ECN
See ECN
See ECN
08/06/02
01/27/03
Change
Orig. of
RYQ
PKS
CJM
NJY
NJY
SYT
New data sheet
Updated features for package offering
Removed 300-MHz offering
Changed tCO, tEOV, tCHZ, tEOHZ from 2.4 ns to 2.6 ns (250 MHz), tDOH, tCLZ
from 0.8 ns to 1.0 ns (250 MHz), tDOH, tCLZ from 1.0 ns to 1.3 ns (200 MHz)
Updated ordering information
Changed Advanced Information to Preliminary
Changed timing diagrams
Changed logic block diagrams
Modified Functional Description
Modified “Functional Overview” section
Added boundary scan order for all packages
Included thermal numbers and capacitance values for all packages
Included IDD and ISB values
Removed 250-MHz offering and included 225-MHz speed bin
Changed package outline for 165FBGA package and 209-ball BGA package
Removed 119-BGA package offering
Minor Change: The data sheets do not match on the spec system and
external web.
Changed ball C11,D11,E11,F11,G11 from DQPb,DQb,DQb,DQb,DQb to
DQPa,DQa,DQa,DQa,DQa in page 4
Modified capacitance values in page 19
Removed 225-MHz offering and included 250-MHz speed bin
Changed t
Changed Θ
TQFP Package on Page # 19
Added lead-free information for 100-Pin TQFP and 165 FBGA Packages
Added comment of ‘Lead-free BG packages availability’ below the Ordering
Information
PRELIMINARY
CYC
JA
from 16.8 to 24.63 °C/W and Θ
from 4.4 ns to 4.0 ns for 250-MHz Speed Bin
Description of Change
JC
from 3.3 to 2.28 °C/W for 100
CY7C1470V25
CY7C1472V25
CY7C1474V25
Page 27 of 27