MT47H128M8HQ-37EL MICRON [Micron Technology], MT47H128M8HQ-37EL Datasheet - Page 21

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MT47H128M8HQ-37EL

Manufacturer Part Number
MT47H128M8HQ-37EL
Description
DDR2 SDRAM
Manufacturer
MICRON [Micron Technology]
Datasheet
Figure 10: 60-Ball FBGA (8mm x 10mm) – x4, x8
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. T 02/10 EN
Solder ball material:
Pb-free – (SAC305) SnAgCu
Pb – (Eutectic) SnPbAg
Dimensions apply to
solder balls post-reflow
on Ø0.35 SMD ball pads.
60X Ø0.45
Seating
0.12 A
Plane
8 CTR
Note:
0.8 TYP
1. All dimensions are in millimeters.
A
9 8 7
6.4 CTR
8 ±0.15
0.8 TYP
3 2 1
A
B
C
D
E
F
G
H
J
K
L
0.8 ±0.1
1.0 X 0.73 MAX
exposed
gold-plated pad
nonconductive floating pad
21
10 ±0.15
Ball A1 ID
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1Gb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.2 MAX
© 2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging

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